Nihon Superior Co., Ltd.

The University of Queensland

Tetsuya Akaiwa

Tetsuro Nishimura

Takatoshi Nishimura

Stuart David McDonald

Kazuhiro Nogita

Shiqian Liu

A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.

Lead-free solder alloy

In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGaor (Cu, Ni)Gabetween the first and second metal base materials, thereby joining the first and second metal material.

Solder joint part and method for manufacturing the same

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Osaka, Japan

Tetsuya Akaiwa