Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Tetsushi Nishio

Masanori Minamio

Toshiyuki Fukuda

Kiyokazu Itoi

Yoshiki Takayama

Hiroshi Horiki

Tetsumasa Maruo

Kenji Tsuji

Yutaka Harada

Hu Meng

Hiroto Osaki

Tomoko Komatsu

Haruto Nagata

Satoru Waga

Masashi Kuroda

An optical device is equipped with a light receiving regionand a peripheral circuit regionlocated around the light receiving regionon a major surface of an light receiving element; electrodes for external connectionelectrically connected to the peripheral circuit regionformed on a back surface opposite to the major surface of the light receiving element; a transparent membercovering the light receiving regionadhered on the major surface of the light receiving elementwith a light-transmitting adhesive; and a molding resinfor coating side surfaces of the transparent memberand the major surface of the light receiving elementexcluding the region covered with the transparent member

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

According to the present invention, a protective seal Sfor protecting a transparent memberis composed of an organic base, adhesive layers, and a second adhesive layerhaving low adhesion. The adhesive layersare provided only on edges corresponding, on the organic base, to sidesof the transparent member and the second adhesive layeris provided on a portion corresponding, on the organic base, to a surfaceof the transparent member. The organic baseis fixed to the sidesand the surfaceof the transparent memberwith the adhesive layersand

Semiconductor device and method of manufacturing the same

A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached.

Optical device and production method thereof

An optical device includes a semiconductor substrate () on which a light receiving part () (or a light emitting part) and electrodes () are formed, and a translucent plate () bonded on the light receiving part () with a translucent adhesive (), the semiconductor substrate () having a plurality of convex portions () formed so as to separate the light receiving part () and the electrodes () and have proper gaps () therebetween.

Optical device and method of manufacturing the same

An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

Optical semiconductor device

A semiconductor device includes: a semiconductor substrate having an imaging region in which a plurality of photoreceptors are arranged, and a peripheral circuit region arranged around the imaging region; a plurality of microlenses formed on the imaging region; a low-refractive-index film formed on the semiconductor substrate to cover the plurality of microlenses and part of the peripheral circuit region; and a transparent substrate formed on part of the low-refractive-index film above the imaging region. A through hole is formed in part of the low-refractive-index film above an amplifier circuit arranged in the peripheral circuit region.

Semiconductor device and electronic apparatus using the same

An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.

Optical device and manufacturing method thereof

An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

Optical apparatus and optical module using the same

An optical device includes a base of ring shape, and an optical chip and a transparent plate both attached to the base. The upper surface of the base is formed with a tapered recess inclined downwardly from its flat portion toward the opening. A gap between the tapered recess and the transparent plate is formed with an adhesive layer. Even if a gap between the transparent plate and the flat portion of the base is narrowed, the adhesive layer with a great thickness present between the tapered recess and the lower surface of the transparent plate maintains the mechanical adhesion strength between the base and the transparent plate. A raised ring and a recessed ring prevent adhesive from entering a positioning hole and the opening.

Optical device

An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the optic device, wherein a pair of positioning pins are provided at the bottom of the cylinder mirror. First positioning holes for defining a mounting position of the cylinder mirror to the base and second positioning holes having a smaller diameter than that of the first positioning holes for defining a mounting position of the optical chip to the base are formed in the base of the optic device.

Optic device

An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.

Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction. Conductive bumps as the connecting members on the electrodes of the semiconductor chip are connected with internal portions of the respective inner leads, the internal portions being positioned inward relative to the protruded portions. The external electrodes are formed on surfaces of the protruded portions, and tip ends of the external electrodes are protruded relative to a back face of the semiconductor chip.

Growing community of inventors

Kyoto, Japan

Tetsushi Nishio