Panasonic Intellectual Property Management Co., Ltd.

Tetsushi Konda

Masahiro Nakamura

Shozo Oshio

Masahito Yamana

Tatsuya Okuno

Yuki Kotani

A connection structure includes: a first structure body and a second structure body which is detachably connected to the first structure body. The first structure body includes a first fitting portion, and the second structure body includes a second fitting portion which is detachably fitted with the first fitting portion. At least one of the first fitting portion or the second fitting portion is an anisotropic elastic structure body including a periodic structure and having an elasticity which differs depending on a direction. When a fitting direction in which the first fitting portion and the second fitting portion are fitted together is a first direction, and a direction which is orthogonal to the first direction is a second direction, the anisotropic elastic structure body has an elasticity which is greater in the second direction than in the first direction.

Connection structure, decoration method, and connection structure body set

A light-emitting device according to an aspect of the present disclosure includes a light transmissive first electrode layer, a light transmissive second electrode layer, an electroluminescent layer between the first electrode layer and the second electrode layer, and a reflective layer located on a side opposite to the electroluminescent layer with respect to the second electrode layer. The reflective layer includes a base material having a refractive index equal to or higher than a refractive index of the electroluminescent layer, and fillers each having a refractive index different from that of the base material.

Light emitting device with reflective layer including filler particles

An organic electroluminescence device comprise an organic electroluminescence element including a pair of electrodes and an organic layer disposed between the pair of electrodes and a sealing resin layer covering a surface of the organic electroluminescence element. The organic layer includes an emitting layer. The sealing resin layer includes a thermoplastic resin composite. The thermoplastic resin composite contains a matrix resin component constituted by at least one resin having a molecular weight of 5000 or more. A content of an organic component having a molecular weight of less than 500 in the thermoplastic resin composite is less than 6 ppm.

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Kyoto, Japan

Tetsushi Konda