Canon Kabushiki Kaisha

Tetsushi Ishikawa

Tamaki Sato

Yasuaki Tominaga

Manabu Otsuka

Masafumi Morisue

Kazuhiro Asai

Atsunori Terasaki

Ryoji Kanri

Masahisa Watanabe

Yoshiyuki Fukumoto

Seiichiro Yaginuma

Akira Yamamoto

Kazuhiro Yamada

Masahiko Kubota

Seiichiro Karita

Keiji Watanabe

Akio Saito

Shingo Okushima

Shuzo Iwanaga

Masataka Kato

Keiji Matsumoto

Noriyasu Nagai

Takatsuna Aoki

Toshiyasu Sakai

Jun Yamamuro

Masaya Uyama

Zentaro Tamenaga

Akihiko Okano

Hiroshi Higuchi

Kenji Tamamori

Tatsurou Mori

Ryotaro Murakami

Kunihito Uohashi

Hideomi Kumano

Takayuki Kamimura

Yoshinao Ogata

Hirono Yoneyama

Provided is a method for manufacturing an element substrate for use in a liquid ejection head for ejecting a liquid to a recording medium. The element substrate, includes: a substrate having a nozzle including an ejection port, and a pressure generating chamber communicating with the nozzle, and subjected to a liquid repellent treatment on a part of a surface on a side opposed to the recording medium; and a generating element for generating an energy for ejecting the liquid. The method for manufacturing an element substrate includes: a liquid repellent treatment step of performing the liquid repellent treatment on the substrate; and a liquid repellent region removing step of removing a part of a liquid repellent region subjected to the liquid repellent treatment so that a non-liquid repellent region not subjected to the liquid repellent treatment is exposed at a surface of the substrate opposed to the recording medium.

Method for manufacturing element substrate, element substrate, and liquid ejection head

A manufacturing method for a structure includes preparing a dry film supported on one surface of a support; bonding the dry film to a substrate so that the dry film and the substrate are in contact with each other; performing first exposure of the dry film bonded to the substrate via the support; removing the support after the first exposure; performing second exposure of the dry film after the support is removed via a photomask; and developing the dry film after the first exposure and the second exposure.

Manufacturing method for structure and manufacturing method for liquid ejection head

A method of manufacturing a structure that includes a substrate provided with a through hole, and a resin layer provided on a front surface of the substrate to close the through hole, includes, in order, preparing the substrate including the through hole and including a support substrate on a back surface of the substrate to close the through hole, bonding a dry film to a front surface of the substrate, the dry film including a support member and a resin layer on the support member, to close the through hole with the resin layer and turn the through hole into a closed space with the substrate, the support substrate, and the dry film, opening the through hole turned into the closed space from the support substrate side, and separating the support member from the dry film while retaining the resin layer on the front surface of the substrate.

Method of manufacturing structure

A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.

Method for manufacturing substrate and liquid ejection head substrate

A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Method of producing structure, protective substrate, and method of producing protective substrate

Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.

Method of manufacturing a liquid ejection head

In a structure such as a liquid ejecting head configured to cover an opening of a base with a covering member, the present invention alleviates the generation of a warp on the structure or the base even if the covering member is hardened and shrunk. The structure includes the base and the covering member attached onto the base. A manufacturing method for the structure includes: a first step of attaching the covering member having flexibility onto the base in such a manner as to cover an opening of the hole formed at the base and a second step of hardening the covering member attached onto the base. In the first step, the covering member is attached onto the base in a state in which a non-stuck portion of the covering member, covering the opening of the base, is slack.

Manufacturing method for structure and manufacturing method for liquid ejecting head

A method for producing a microstructure provided with a member in which, on a substrate having a plurality of concave shapes processed thereon, a dry film resist is subjected to tenting on open faces of a plurality of concave shapes, and then openings are formed in the dry film resist where divided exposure is performed such that patterning is performed with first exposure light and second exposure is performed to cause overexposure.

Method for producing microstructure and method for producing liquid ejection head

A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.

Method of forming space for use in analysis devices

Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10&#xb0; or more is 1/100000 or less of the light intensity at a scattering angle of 0&#xb0;, at a wavelength of 400 nm.

Method of producing structure and method of producing liquid discharge head

A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.

Method of manufacturing structure and method of manufacturing liquid ejection head

A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X&#x2265;30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Method for manufacturing structure

A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

Liquid discharge head, manufacturing method therefor, and recording method

A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Liquid ejection head, liquid ejection apparatus, and manufacturing method

A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.

Growing community of inventors

Tokyo, Japan

Tetsushi Ishikawa