Resonac Corporation

Showa Denko Materials Co., Ltd.

Tetsurou Iwakura

Aya Kasahara

The present invention relates to a thermosetting resin composition containing an inorganic filler (A) containing a nanofiller (a), a thermosetting resin (B), and an elastomer (C); and a thermosetting resin composition containing an inorganic filler (A), a thermosetting resin (B), and an elastomer (C), wherein the inorganic filler (A) has at least two peaks of a first peak and a second peak in a particle size distribution measured according to the laser diffraction scattering method, and a peak position of the first peak appears at 0.3 to 0.7 &#x3bc;m, while a peak position of the second peak appears at 0.7 to 1.2 &#x3bc;m.

Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof

A composite film for electronic device using high frequency band signals, which is low in dielectric tangent, excellent in embedding properties relative to unevenness of a circuit, etc., and excellent in surface smoothness, and has high adhesion to plated copper is provided; and a printed wiring board containing a cured material of the composite film for electronic device and a method of producing the printed wiring board are also provided. Specifically, the composite film for electronic device is a composite film for electronic device using high frequency band signals, including a layer A having a minimum melt viscosity at 80 to 150&#xb0; C. of 100 to 4,000 Pa&#xb7;s; and a layer B having a minimum melt viscosity at 80 to 150&#xb0; C. of 50,000 Pa&#xb7;s or more. The composite film for electronic device is low in thermal expansion properties and excellent in handling properties of film.

Growing community of inventors

Tokyo, Japan

Tetsurou Iwakura