Hitachi Chemical Company, Ltd.

Tetsurou Iwakura

Masao Suzuki

Teiichi Inada

Takayuki Matsuzaki

Keiji Sumiya

Yasushi Shimada

Hiroyuki Kuriya

Keiichi Hatakeyama

Takeo Tomiyama

Yuuko Tanaka

Hiroyuki Kawakami

Youichi Hosokawa

Atsushi Takahashi

Tomoaki Shibata

Masaaki Yasuda

Michio Uruno

Masaya Nishiyama

Keisuke Ookubo

Takahiro Tokuyasu

Megumi Kodama

Yuuji Hasegawa

The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50&#xb0; C., (B2) a thermosetting component having a softening point of between 50&#xb0; C. and 100&#xb0; C. and (C) a phenol resin having a softening point of no higher than 100&#xb0; C., the composition containing 11 to 22 mass % of the (A) high-molecular-weight component, 10 to 20 mass % of the (B1) thermosetting component having a softening point of below 50&#xb0; C., 10 to 20 mass % of the (B2) thermosetting component having a softening point of between 50&#xb0; C. and 100&#xb0; C. and 15 to 30 mass % of the phenol resin having a softening point of no higher than 100&#xb0; C., based on 100 mass % of the resin composition.

Adhesive sheet and method for manufacturing semiconductor device

The present invention provides an adhesive composition for an optical waveguide which comprises (a) an epoxy resin, (b) a curing agent and (c) a high molecular compound, in which a total light transmittance and a light transmittance in a wavelength of 700 to 1600 nm in a cured matter of the adhesive composition are 80% or more and in which a transparency is consistent with a heat resistance, an adhesive film for an optical waveguide prepared by forming the above adhesive composition into a film form, an adhesive sheet for an optical waveguide comprising the above adhesive composition and a supporting base material and an optical device produced by using them.

Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them

Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer

There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.

Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device

Growing community of inventors

Tsukuba, Japan

Tetsurou Iwakura