Kyocera Corporation

Fj Composite Materials Co., Ltd.

Tetsurou Abumita

Masahiro Okumura

Yoshiaki Ueda

Masakazu Yasui

Atsushi Ogasawara

Eiki Tsushima

Takeshi Ogawa

Atsurou Yoneda

Junji Kurokawa

Kazutsugu Kobayashi

Motoaki Yoshida

An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member () is used which comprising at least five layers including first metal layers () having good thermal conductivity and second metal layers () having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (), the first metal layers () and second metal layers () being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer () being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component () can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion () can be brought close to that of the electronic component () or the like.

Electronic component storing package and electronic apparatus

A composite ceramic body and a method thereof are provided. The composite ceramic body comprising a first bonding body comprising a ceramic containing Si ingredient, and a second bonding body bonded to the first bonding body through a bonding material containing, as main ingredient, a Si compound which includes the element common to the Si ingredient contained in the first bonding body. The first and second bonding bodies can be bonded strongly and uniformly without any adhesive. Since the composite ceramic body has high bonding strength, it is applicable to microchemical chips and reformers.

Composite ceramic body

Growing community of inventors

Higashiomi, Japan

Tetsurou Abumita