Fujitsu Corporation

Fujitsu Limied

Sunarrow Limited

Zeon Rize Co., Ltd.

Tetsuro Yamada

Akiko Matsui

Kohei Choraku

Yoshiyuki Hiroshima

Takahide Mukoyama

Mitsuhiko Sugane

Takahiro Ooi

Yoshihiro Morita

Naoki Nakamura

Kazuki Takahashi

Shigeo Iriguchi

Masahiro Iwama

Daisuke Usui

Takeshi Nishiyama

Mitsunori Abe

Yoshio Kenmochi

Kiyoshi Kuwabara

Masahiko Sakuraoka

Takahide Mukouyama

Atsuo Ishikawa

Ichiro Kawabuchi

Yoshio Kobayashi

Sotaro Kobayashi

Misuhiko Sugane

A specific conductivity measurement method includes: performing first measurement to obtain a resonance frequency fthat is outputted to a measuring device when the first and second dielectric flat plates each have a thickness t, and an unloaded Qthat corresponds to the resonance frequency f; performing second measurement to obtain a resonance frequency fthat is outputted to the measuring device when the first and second dielectric flat plates each have a thickness tthat is different from the thickness t, and an unloaded Qthat corresponds to the resonance frequency f; and calculating a specific conductivity &#x3c3;of the copper foil and the first and second conductor flat plates based on an arithmetic equation that includes the resonance frequency the unloaded Q, the resonance frequency f, and the unloaded Q.

Specific conductivity measurement method, recording medium recording specific conductivity calculation program, and specific conductivity measurement system

An electronic component includes: a first terminal that is inserted into a first through hole in a substrate; and a second terminal that is inserted into a second through hole in the substrate, wherein a length of the first terminal from a first end that is inserted into the first through hole to a second end is longer than a length of the second terminal from a third end that is inserted into the second through hole to a fourth end, and a cross sectional area of a portion of the first terminal positioned on a side of the second end with respect to a first joined portion is larger than a cross sectional area of a portion of the second terminal positioned on a side of the fourth end with respect to a second joined portion.

Electronic component and substrate

An optical waveguide substrate includes a substrate that includes a recess, a buffer layer disposed on a bottom surface and a wall surface of the recess, and an optical waveguide disposed inside the recess with the buffer layer interposed therebetween and having a cladding layer disposed on the buffer layer and a core layer disposed inside the cladding layer.

Optical waveguide substrate, method of manufacturing optical waveguide substrate, and method of repairing optical waveguide substrate

A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.

Wiring board manufacturing method

A light emitting element bonded board includes an optical waveguide formed within a board, a hollowed portion in the board, a light emitting element installed in the hollowed portion, and a conductive portion formed in an upper layer and/or a lower layer of the optical waveguide, wherein an optical axis of the light emitting element coincides with a center line of the optical waveguide, and a bonding portion of the light emitting element is bonded to the conductive portion.

Light emitting element bonded board and method of manufacturing light emitting element bonded board

A printed circuit board includes a power feeding layer to which a power supply voltage is applied, a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage to the electronic component, and a plurality of vias that electrically interconnects the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to an end of the area has a smaller via-diameter.

Printed circuit board and electric device

A wiring board includes: a first substrate that includes signal wiring; a second substrate that includes a conductor with an area larger than an area of the signal wiring, and projection formed on a face of the conductor and constituted of an insulator with a pattern corresponding to a pattern of the signal wiring, the second substrate being arranged so that the face of the conductor on which the projection is formed faces the signal wiring; and an intermediate layer that is arranged between the signal wiring and the conductor and includes a fibrous member.

Wiring board, electronic apparatus, and manufacturing method of wiring board

An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.

Optical interconnection substrate including optical transmitter with light source and mark or optical receiver with light receiving unit and mark

A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates and filled with the dielectric; a first conductor film formed on an inner surface of the through hole; and a second conductor film covering the through hole on a main surface of each of the two substrates on an opposite side to the dielectric, the second conductor film being connected to the first conductor film on the main surface side.

Circuit board and method of manufacturing the same

A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.

Printed circuit board, electronic device, and manufacturing method

Optical axis adjustment method for optical interconnection, and optical interconnection substrate

A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Placement apparatus and a suction nozzle for an optical component

A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.

Method of manufacturing photoelectric composite substrate

An electronic device includes a board including an electronic component, a plurality of optical interface units that include an optical element which input or output light and that are provided on the board, and a plurality of individual positioning units that position a plurality of respective optical waveguides which are separate from each other at least at tip portions on a side of the optical interface units and which are optically aligned with the optical element with respect to the optical interface units independently from each other.

Growing community of inventors

Kawasaki, Japan

Tetsuro Yamada