Mitsubishi Denki Kabushiki Kaisha

Other

Tetsuro Washida

Katsunori Ochi

Shigeo Onoda

Jun Ohbuchi

Makoto Omori

Yasuhiro Murasawa

Hidenobu Gochi

Kiyotaka Nishino

Takao Nakajima

Shigeru Furuta

Masataka Wada

Yoshitaka Mizutani

Teru Hirata

Tetsurou Tsuji

A packaging substrate is provided such that an electronic components having a plurality of connecting terminals at their side edge portions and other kind of electronic component are mounted in high density on the substrate. More specifically, in a packaging substrate having IC packages (electronic components) surface mounted on the substrate, the package body of each IC package having a plurality of outwardly extending lead terminals at their side edge portions, the package body of the IC package includes at its side edge portion a specified length open region with no connecting terminal disposed therein. The IC packages are arranged in such a way that open regions of adjacent IC packages are positioned so as to confront each other and that front ends of individual leads are kept in closely spaced relation within a specified spacing range, a bypass capacitor (other kind of electronic component) being surface mounted between the open regions of the adjacent IC packages.

Packaging substrate

A semiconductor device comprising a plurality of bump electrodes wherein signal pins requiring electrical connection are assigned in sequence from the bump electrodes at the outermost periphery near the edge of the semiconductor device to the bump electrodes in an interior area of the semiconductor device, and no-connection pins requiring no electrical connection are assigned to the remaining bump electrodes, is provided. Circuit board cost is thus reduced, and the ease of mounting the semiconductor device to the circuit board is improved.

Semiconductor device

A terminal structure in a memory module includes a male connector having a plurality of terminal strips adapted to be engaged with the terminal tongues in the female socket. Each of the terminal strips has an obstacle removal portion defined therein for removing foreign matter present on at least one of the terminal tongues.

Memory module with obstacle removing terminal structure

A module mounted in relative high density with semiconductor devices is disclosed. The module includes a mounting substrate which has a hole section; a first semiconductor device having bump electrodes which protrude from one principal surface of a package and lead terminals electrically connected to the bump electrodes; a second semiconductor device which also has bump electrodes that can be structurally and electrically coupled with the bump electrodes of the first semiconductor device and where this second semiconductor device is able to be located in the hole section of the mounting substrate, and where the first semiconductor device is able to be supported on the mounting substrate through the lead terminals; and where the bump electrodes of both semiconductor devices are electrically connected to each other.

Module mounted with semiconductor device

A semiconductor device is formed of stacked first and second semiconductor substrates each having internal circuits which are packaged within a package having a plurality of bump electrodes on the top and bottom principal planes. The bump electrodes on the top principal plane of the package are electrically connected to the internal circuits of the first semiconductor substrate and the bump electrodes on the bottom plane of the semiconductor substrate are electrically connected to the internal circuit of the second semiconductor substrate with the first and second semiconductor substrates arranged in mirror symmetry both physically with respect to each other and with respect to signals to be input into or output from the internal circuits. Module structures using a plurality of the semiconductor devices mentioned above are also described.

Semiconductor device with a package having a plurality of bump

IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

IC card

A semiconductor integrated circuit device includes a semiconductor integrated circuit chip, a IC package enclosing the semiconductor integrated circuit chip, lead terminals, and dummy terminals. The lead terminals are partly embedded in the IC package side by side along its opposed sides, and the dummy terminals are partly embedded in the IC package at both ends of a line of the lead terminals. These terminals are electrically connected with the circuit formed in the chip. One end of each terminal protrudes from either of the opposed sides of the IC package and has a connection to be connected with terminal electrodes of a packaging substrate. The dummy terminals are made wider and/or longer than the lead terminals so as to make their connections larger than those of the lead terminals, thereby enhancing their reliability in point of machine-resistance and heat-resistance.

Terminal configuration in semiconductor IC device

A printed circuit board includes first and second flat portions each including first and second sides for mounting a electrical elements. A bending portion joins the flat portions and bends to place the flat portions in a superposed state. A cutout having an elongate portion and an end portion is located in the bending portion. The end portion is substantially equal in width to the bending portion. The elongate portion is narrower than the bending portion. The elongate portion creates additional flat portions for mounting elements when the first and second flat portions are in the superposed state. The end portion is resistant to bending strain. The end portion may be circular, semi-circular, or another shape.

Bendable circuit board having improved resistance to bending strain and

An IC card includes a first cover including a first flat panel portion and a first upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion, and a second cover including a second flat panel portion and a second upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion. The first upright wall portion defines a chamber in cooperation with a portion of the first flat panel portion. The first and second covers are mated together with the first and second upright wall portions bonded together in a butt fashion.

IC card and method of making the same

An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

An IC card including an electric circuit board and have face and back metallic panels that include a housing and are attached to a resin frame. The IC card has a discharge pattern formed on the electric circuit board for discharging static electricity applied to the metallic panels, a conductor elastically disposed between one of the metallic panels and the discharge pattern for electrically coupling one of the metallic panels with the discharge pattern, and a ground pattern formed on the electric circuit board with the ground pattern separated by a given distance A from the discharge pattern for routing the static electricity to a card connector. The given distance A is a distance necessary for the static electricity to start discharging at a given voltage. A given distance needed for discharge can be maintained precisely through a simple manufacturing process. A fluctuation in discharge start voltage can therefore be minimized. This results in a highly reliable product.

IC card with a discharge pattern and a ground pattern separated from

A non-contact IC card capable of communicating with external equipment at various communication frequencies. An antenna circuit of variable frequency and a frequency switching circuit for supplying communication clock signals of variable frequency to a modulator-demodulator circuit are provided so that communication is performed by switching a constant of the antenna circuit and the frequency of the communication clock signal generated from the frequency switching circuit in accordance with the frequency of external equipment with which communication is effected.

Non-contact IC card communicating at multiple frequencies

A semiconductor module includes a plurality of circuit boards superposed one on another, each circuit board having two opposed surfaces; and groups of electronic parts mounted on the two opposed surfaces of each of the circuit boards, the groups of electronic parts including IC packages, each IC package having a package body and leads extending outward from at least one side surface of the package body, wherein the IC packages mounted between an adjacent pair of the circuit boards in a back-to-back relationship are located on the circuit board so that the leads of one of the IC packages on one of the circuit boards are directly opposite the package body of an IC package on the other of the circuit boards.

Semiconductor module having multiple circuit boards

An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

IC card including a substrate having improved strength and heat

A semiconductor module including a plurality of circuit boards, each circuit board having two opposed surfaces on which IC packages having leads extending outward through upper or lower portions of side surfaces are mounted. The circuit boards are superposed one on another and the IC packages are arranged to prevent contact between the leads of the IC packages disposed close to or in contact with each other in a back-to-back relationship between each adjacent pair of circuit boards. The IC packages mounted between each adjacent pair of circuit boards in a back-to-back relationship are upper lead type IC packages on one of the circuit boards and lower lead type IC packages on the other circuit board.

Growing community of inventors

Tokyo, Japan

Tetsuro Washida