Omron Corporation

Tetsuro Tsurusu

Mitsunori Sugiura

Masayuki Noda

Shingo Kawamoto

Masaaki Abe

Kohei Fujio

Akihiro Ishii

Ryoji Shimizu

Shuichi Itoda

Toshinobu Akutagawa

Tetsuya Minobe

Tsuyoshi Okubo

Yuki Honda

Yosuke Morimoto

Takahide Yagi

Yuji Makita

It is an object of the present invention to provide a dimensional information management device with which search information about a buried object in a target can be effectively utilized, and the burden on the worker can be reduced, as well as a dimensional information management system comprising this dimensional information management device. A dimensional information management devicemanages dimensional information about a buried objectincluded in a search image showing the presence or absence of the buried object in a wall surfacegenerated by a buried object scanning devicethat has been scanned along the wall surface, said dimensional information management device comprising a data receiving unitand a memory unit. The data receiving unitacquires search information including a search image from the buried object scanning device. The memory unitstores the search information acquired by the data receiving unit

Dimensional information management device, dimensional information management system comprising the same, dimensional information management method, and dimensional information management program

A buried object scanning device includes a capacitance sensor, a search image conversion processing unit, a memory unit, a display unit, an operation input unit, and a display control unit. The capacitance sensor detects a buried object. The search image conversion processing unit converts the detection result of the capacitance sensor into a search image. The memory unit stores search images and a grid layer including grid lines corresponding to a specific scale. The display unit displays the search images and the grid layer. The display control unit controls the display unit to display the search image superimposed with the grid layer and to display the search image in a state of being movable relative to the grid layer, in response to input to the operation input unit.

Buried object scanning device, display control method for buried object scanning device, and display control program

A buried object information management unit manages information about a buried object included in a search image showing the presence or absence of the buried object in a wall surface generated by a buried object scanning device that is scanned along a wall surface, and comprises a data receiving unit, an input unit, and a collation unit. The data receiving unit acquires search information including the search image generated by the buried object scanning device. To the input unit is inputted construction information including position information about the buried object in the wall surface. The collation unit collates the search information acquired by the data receiving unit with the construction information inputted to the input unit, and determines whether or not there is a match.

Buried object information management device, buried object information management system comprising same, buried object information management method, and buried object information management program

A high frequency relay is provided with an insulating outer housing, a relay body including an electromagnet unit and a contact mechanism unit, and a shield member. The relay body has a plate-like relay terminal, and the relay terminal is disposed such that the plate surfaces of the relay terminal extend along second surfaces of the relay body and one of the plate surfaces is exposed from at least one of the second surfaces. On the second surface, an insulator capable of insulating the relay terminal and the shield member is provided between the plate surface of the relay terminal and the shield member.

High frequency relay

In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.

Semiconductor relay module

Growing community of inventors

Takatsuki, Japan

Tetsuro Tsurusu