Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Osaka University

Tetsuro Ogushi

Akira Yamada

Shigetoshi Ippoushi

Nobuaki Uehara

Hiroshi Chiba

Hisaaki Yamakage

Hiroshi Yamabuchi

Yoshihito Asao

Takashi Kobayashi

Hiroaki Ishikawa

Hitoshi Isoda

Yoshikatsu Hayashi

Mihoko Shimoji

Kazushige Nakao

Masaaki Murakami

Toshiyuki Umemoto

Masami Yoshikawa

Makoto Tomidokoro

Toshinori Nakagawa

Atsushi Tsujimori

Yoshihiro Kamoya

Yutaka Noda

Hideo Nakajima

Haruhiro Oda

A heat sink includes a base having a first surface thermally connected to a heat producing component and a plurality of fins supported by a second surface of the base and arranged in a predetermined direction, each fin having a plurality of through-holes. The base and the plurality of fins are integrally formed from a porous material, for example a lotus-shaped porous material. The heat sink is placed within a duct. The heat sink may have a width of about 10 mm or less.

Heat sink and fabricating method of the same

A cooling device of a linear motor to cool a primary side of the linear motor including an iron core and a coil accommodated in slots of the iron core, including an elongate cover covering coil end portions exposed from both side faces of the iron core in a longitudinal direction, an air channel serving as blower for forcing a current of cooling air inside the cover, and a partition plate dividing the inside of the cover into upper and lower spaces. It is configured in such a manner that the upper space divided by the partition plate is used as a ventilation portion through which a current of cooling air is forced and the lower space is used as a cooling portion in which the coil end portions are accommodated and cooled. A slit is formed almost along a full length of the partition plate on a side closer to the iron core for bringing the ventilation portion and the cooling portion into communication with each other, and a vent is provided in a lower portion of the cooling portion.

Cooling device of linear motor

A pump-free water-cooling system includes a heat-exchange circulating solution container containing heat-exchange circulating solution and vapor of the circulating solution, at least one solution outlet to discharge the circulating solution from the container, and a gas-liquid two-phase fluid inlet to charge into the container gas-liquid two-phase fluid composed of the circulating solution. The system also includes a circulating-solution transporting route in which a first transportation route is linked to a second transportation route which is linked to a third transportation route. A sensible-heat-emitting heat exchanger is provided along the first transportation route. The first transportation route is linked with the solution outlet. Heat exchange is carried out along the second transportation route at least between circulating solution therein and the circulating solution in the container. A heating heat exchanger is provided along the third transportation route. The third transportation route is linked with the gas-liquid two-phase fluid inlet.

Pump-free water-cooling system

A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Vapor-lift pump heat transport apparatus

A large number of ventilating apertures that have a circular cross section are disposed through the heatsink so as to extend from an air intake apertured surface to an air discharge apertured surface so as to have aperture directions that are parallel to each other and parallel to an element mount surface, and the heatsink is disposed such that the air intake apertured surface faces an air intake aperture and the aperture directions of the ventilating apertures are aligned in a direction of flow of a cooling airflow.

Automotive dynamoelectric machine

A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module () through the medium of cooling water includes a base member (), a heat sink body () superposed on the base member () to form in cooperation with the base member () a passage through which the coolant flows, and a bellows-like flow straightening plate () disposed between the power semiconductor module () and the base member () in physical contact with the power semiconductor module () on one hand and with the base member () on the other hand. The flow straightening plate () partitions the passage into a plurality of flow straightening channels (A,B).

Heat sink

A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured. The pump-free water-cooling system includes: a heat-exchange circulating solution container in which a heat-exchange circulating solution and vapor of the circulating solution are contained; a heat radiator provided on the outer wall of the container; a solution outlet for discharging from the container the heat-exchange circulating solution in the container; a gas-liquid two-phase fluid inlet for charging into the container gas-liquid two-phase fluid composed of the heat-exchange circulating solution at high temperature and vapor bubbles of the circulating solution; a first transportation route along which a sensible-heat-emitting heat exchanger is provided, the first transportation route linking with the solution outlet; a second transportation route along which heat exchange is carried out between heat-exchange circulating solution therein and the heat-exchange circulating solution in the container and the vapor of the heat-exchange circulating solution in the container; a third transportation route along which a heating heat exchanger is provided, the third transportation route linking with the gas-liquid two-phase fluid inlet; and a circulating-solution transporting route in which the first transportation route, the second transportation route, and the third transportation route are linked in that order.

A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.

Heat transport device, semiconductor apparatus using the heat transport device and extra-atmospheric mobile unit using the heat transport device

The conventional thermal transport system has disadvantages of the configuration being complex, large, heavyweight and expensive. In the present invention, a plurality of evaporators are connected in series via the liquid flow line, the evaporator of the first position is connected to the condenser via the liquid supply line, the evaporator of the last position is connected to the reservoir tanks for adjusting the amount of the liquid. The liquid amount measuring sensor is installed to measure the amount of the liquid in the liquid reservoir of the evaporator. Based on the measured result of the liquid amount measuring sensor, the control valve operates so as to supply the liquid accommodated in the reservoir tanks to each evaporator.

Evaporator, a heat absorber, a thermal transport system and a thermal transport method

An apparatus operable on each elevator platform for opening or closing doors wherein the apparatus includes a pair of doors for opening or closing an inlet/outlet on the elevator platform, a rail for guiding the rolling movement of rollers carried by a hanger plate standing upright on the upper surface of each door and a door-sill arranged below said inlet/outlet for guiding the slidable movement of a door shoe at the lower end of each door. Each door is essentially composed of a door main body having a vertically extending reinforcement member for supporting the dead weight of each door and a thermal insulating panel fixedly secured to the door main body on the elevator platform side, the thermally insulating panel being filled with a thermal insulating material, and a decorative plate is adhesively secured to the front surface of the thermal insulating panel on the elevator platform side.

Growing community of inventors

Tokyo, Japan

Tetsuro Ogushi