Matsushita Electric Industrial Co., Ltd.

Tetsuro Nakamura

Shinji Fujiwara

Eiichiro Tanaka

Masahiro Nakagawa

Takahiko Murata

Kenichi Masumoto

Akira Gyoutoku

Takafumi Hamano

Yuzo Kawano

Eiji Kawamoto

Yuuji Toyomura

Yuji Toyomura

Shinya Yamamoto

Masichiro Tatekawa

Takashi Yamanaka

Kohichi Takesako

Toshiro Horiuchi

Yoshihiko Chosa

Providing an exposure unit using an organic electroluminescence element with a large emitted light quantity. The organic electroluminescence element has, on a substrate, an anodeacting as a hole injection electrode, a cathodeacting as an electron injection electrode, a first and second emission layersandeach having a light emission region, and a charge generation layerinjecting electrons into the light emission layerlying close to the anodeand injecting holes into the light emission layerlying close to the cathode, these layers being arranged between the anodeand the cathode

Organic electroluminescence element and an exposure unit and image-forming apparatus both using the element

An image forming apparatus includes an exposer including an organic electroluminescence element including at least an anode for injecting a hole, a luminescent layer having a luminescent region and a cathode for injecting an electron on a board. A photosensitive member is formed with an electrostatic latent image by exposing light of the exposer, a developer forms a toner image on the photosensitive member by supplying a toner to the electrostatic latent image, and a cooler cools the organic electroluminescence element such that the temperature of the organic electroluminescence element can be controlled.

Image forming apparatus having a cooler for an organic electroluminescence element

The invention comprises a display sheet, a light guide sheet and a light source provided to at least one side of the light guide sheet. And an electronic paper of the invention has a configuration for color display that the display sheet is made up by laminating respective display sheets for red, green and blue colors.

Display device, electronic paper and electronic paper file

The present invention relates to a linear beam irradiator, more specifically to a linear beam irradiator for using light conductor, comprising a light conductor having light permeability, a light refraction & reflection area provided on one side face in the longitudinal direction of said light conductor, and a light source provided in a way to cover the light refraction & reflection area as well as a light source disposed at one end or both ends of said light conductor. This construction makes it possible to irradiate a linear light beam from the other side face of the light conductor corresponding to said light refraction & reflection area With this construction, it becomes possible to reduce the deviation of illuminance of said linear light beam, sharply improve the transmission efficiency of light and greatly reduce the number of LED chips disposed at the light source. Moreover, this also enables a cost reduction.

Linear beam irradiator having a varying cross-sectional size

A linear illumination device, includes: a light conducting body; a light diffusion portion formed at least on one side surface in a longitudinal direction of the light conducting body; a light output portion formed in a portion of the light conducting body opposing the light diffusion portion; a light source portion disposed at a first end of the light conducting body; and a light reflecting layer provided at a second end opposing the first end of the light conducting body.

Linear illumination device and image reading apparatus using the same

A direct contact type image sensor includes an optical fiber array plate including a transparent substrate and an optical fiber array and having a lower face brought into close contact with an original document. A semiconductor image sensor chip including a photosensor array is mounted on an upper face of the optical fiber array plate by transparent photo-setting and insulating resin. A circuit conductive layer is formed on an upper face of the transparent substrate, and a bump electrode is formed on a lower face of the semiconductor image sensor chip so as to be brought into contact with the circuit conductive layer. A light source is provided for illuminating the original document. The optical fiber array plate is formed, on the upper face, with a slit for allowing light from the light source to pass therethrough. A first light shielding layer is provided at other portions of the lower face of the optical fiber array plate than that corresponding to the optical fiber array, and a second light shielding layer is provided at other portions of the upper face of the optical fiber array plate than those corresponding to the optical fiber array and the slit.

Direct contact type image sensor and its production method

A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; e transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.

Direct-contact type image sensor device, an image sensor unit, and

A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; a transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.

The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.

Direct-contact type image sensor using optical fiber array with light

A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated metal layer upon the circuit conductor layer.

Semiconductor device, an image sensor device, and methods for producing

This invention relates to an image sensor with photo sensors (13). An object thereof is to simplify mounting operation of an image sensor chip (12) provided with the photo sensors (13). In order to accomplish this object, according to this invention, the photo sensors (13) and electrodes (15) are disposed on the underside of the image sensor chip (12). The image sensor chip (12) is bonded to the upper side of a transparent substrate (18) by means of a transparent photo-setting type insulating resin (16), so that the electrodes (15) come into contact with circuit conductor layers (17) disposed on the upper side of the transparent substrate (18). With the above-mentioned construction, since fine metal wire (75) by which the electrodes (15) and the circuit conductor layers (17) are connected to each other is not required, mounting operation can be simplified.

Image sensors with an optical fiber array

Methods for the production of image sensors having simplified chip mounting are provided which comprise disposing a photo-setting type insulating resin on the upper side of a substrate, a portion of the substrate being transparent and having circuit conductor layers on its upper side; bringing an image sensor chip, the underside of which has electrodes, into contact with the upper side of the substrate so that the photo-setting type resin is wedged away and the electrodes come into contact with the corresponding circuit conductor layers; flowing current into the image sensor chip through the circuit conductor layers to determine that the image sensor chip operates in a normal manner; and irradiating the photo-setting type resin with light so that the resin is hardened.

Growing community of inventors

Hyogo, Japan

Tetsuro Nakamura