Tdk Corporation

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha

Kogyo Kabushiki Kaisha

Tokyo Denki Kagaku

Tokyo Denki Kogaku Kogyo Kabushiki Kaisha

Tetsuro Ito

Kotaro Harigane

Hiroshi Yagi

Yoshio Harada

Yoshinobu Taguchi

Tetsuo Takahashi

Masayoshi Kobayashi

Akihiro Kato

Keiichi Ihara

Hirokazu Shudo

Atsushi Shindo

Tsuyoshi Ito

A chip feed apparatus capable of permitting a chip feed casing to be used for storage and transportation of chips in a distribution channel as well and preventing a weight of chips from being applied to a chip storage space of a hopper, resulting in positive separation and feeding of chips by the hopper. The chip feed apparatus includes a chip feed casing formed on a side surface thereof with a chip outlet, a hopper formed on a side surface thereof with a chip inlet and connected to the chip feed casing while enabling vertical movement of the hopper, a chip separating and aligning pipe inserted into a hole communicating with the chip storage space, and a chip feed path of which one end communicates with the chip separating and aligning pipe and the other end is defined at a chip pick-up position. The chip outlet of the chip feed casing is open at a lowermost end of a chip receiving space or below the lowermost end. The side surface of the chip feed casing and the side surface of the hopper are connected to each other while the chip outlet and chip inlet are kept aligned with each other.

Chip feed apparatus and chip feed casing therefor

An apparatus for automatically mounting an electronic device having a plurality of leads on a printed circuit board, by inserting the leads into mount holes of the printed circuit board. A plurality of extension pins are connected straight to the leads to hold the leads of the electronic device. The extension pins are inserted into the mount holes, while the connection between the extension pins and the leads is maintained. The extension pins are then removed from an opposite side of the printed circuit board, thus guiding and inserting the tips of the leads into the mount holes.

Apparatus for mounting electronic device on a printed circuit board

Apparatus for supplying and transferring electronic components includes a plurality of pallets each for receiving and holding one electronic component. An endless conveying mechanism conveys the pallets in and intermittent fashion on a substantially horizontal plane. A supply unit mechanism selectively supplies electronic components to the pallets.

Method of and apparatus for supplying and transferring electronic

A device for cutting lead wires of an electronic circuit element mounted on a printed circuit board into a desired length and for bending the lead wires to be close to the bottom surface of the printed circuit board is capable of dealing with an electronic circuit element having three lead wires as well as that having two lead wires. The device comprises a fixed block having a stationary blade which has two side holes and a central hole formed therethrough, a pair of side levers having laterally movable blade members which are slidable on the surface of the stationary blade to cut and bend lead wires inserted through the side holes of the stationary blade, and a central lever having a movable blade member which are slidable on the surface of the statonary blade to cut and bend a lead wire inserted through the central hole of the stationary blade.

Device for cutting and bending lead wires

An electronic component selection and supply apparatus for use in an automatic electronic component inserting machine for automatically inserting electronic components of irregular shapes which are unsuitable for taping, such as electrolytic capacitors, power transistors and variable resistors, into a printed circuit board includes selection and supply apparatus for selecting an electronic component at a first position and supplying the selected component to a second position, the apparatus including electronic component sequence apparatus for selecting a predetermined electronic component which includes a device for vertically holding a plurality of electronic component magazines accommodating the electronic components at predetermined positions in a stacked state, and chuck apparatus for receiving the predetermined electronic component selected by the electronic component sequence apparatus and for supplying the electronic component to the second position.

Electronic component selection and supply apparatus in automatic

Apparatus for automatically inserting parallel leads of electronic components into openings in a printed circuit board having an improved lead holding and guiding assembly. The improved lead holding and guiding assembly is associated with the frame of the apparatus and includes a guiding member mounted for rotation about an axis of rotation which extends in the x-direction, i.e., in the direction of a line which is orthogonal to both of the parallel leads, and for longitudinal movement in the z-direction, i.e., in the direction which is perpendicular to the orthogonal plane which contains the orthogonally extending line. The holding and guiding assembly further includes a pair of holding members disposed at respective sides of the guiding members such that the side surfaces of the end portion of the guiding member and the respective inner side surfaces of the holding members constitute lead holding and guiding portions. The holding members are mounted for rotation relative to the guiding member about respective axes of rotation so that the lead holding and guiding portions can be opened and closed as the holding members are rotated.

Inserting assembly for automatically inserting parallel lead electronic

An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device. A transfer device includes a reciprocating unit for producing reciprocative movements between the cutter and the lead holding and guiding device and an electronic component holding device for holding a lead of the electronic component to be separated by the cutter and transferring the component to the lead holding and guiding device after such component has been separated by the cutter.

Machine for inserting electronic components

An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.

Growing community of inventors

Tokyo, Japan

Tetsuro Ito