Shell Oil Comapny

Resolution Performance Products LLC

Tetsuro Imura

Takao Fukuzawa

Yoshinobu Ohnuma

Takayoshi Hirai

Yasuyuki Murata

Yoshinori Nakanishi

Masayuki Ohta

Composition of epoxy resin and triazine-formaldehyde-phenol resin

A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.

High molecular weight epoxy resin and resinous composition for printed circuit board

The present invention provides an epoxy resin composition useful for casting applications, comprising a reaction product obtained by reacting (A) a bisphenol epoxy resin, and (B) bisphenol compounds, and if necessary, (C) monofunctional phenols or carboxylic acid compounds, in the presence of sodium compounds, wherein the epoxy resin composition has

Epoxy resin composition

A modified liquid epoxy resin composition is provided by reacting a crystalline epoxy resin, from about 3 to about 20 parts by weight, based on the epoxy resin, of a compound having two or more phenolic hydroxyl groups and/or carboxyl groups in one molecule and from about 3 to about 20 parts by weight of a compound having one phenolic hydroxyl group or carboxyl group in one molecule. The crystalline epoxy resin is preferably selected from various glycidylethers of biphenol compounds. The modified liquid epoxy resin composition has a low viscosity and good liquid stability at low temperatures, resulting in cured resins having excellent heat resistance and water resistance.

Modified liquid epoxy resin composition

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Yokkaichi, Japan

Tetsuro Imura