Canon Kabushiki Kaisha

Sumitomo Metal Industries, Inc.

Other

Tetsuo Yoshizawa

Hiroshi Kondo

Takashi Sakaki

Yoshimi Terayama

Toyohide Miyazaki

Yasuteru Ichida

Kazuo Kondo

Yasuo Nakatsuka

Yoichi Tamura

Takahiro Okabayashi

Yuichi Ikegami

Masaki Konishi

Shunichi Haga

Masaaki Imaizumi

Hideyuki Nishida

Yasuo Suda

Keiji Ohtaka

Toshiaki Sato

Takashi Miyake

Ichiro Ohnuki

Akio Mihara

Taichi Sugimoto

Shin-ichi Urakawa

Hiromichi Yamashita

Susumu Kadokura

Tomoaki Kato

Yoshimi Tarayama

In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Semiconductor device and method for producing the same

An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes, i.e., to be porous, or in the alternative, annealed to soften the exposed portions. The holding member is formed by depositing several insulating layers such as resin on a conductive substrate, etching the substrate to form openings, filling the openings to form bumps, and then removing the substrate and an insulating layer thus leaving another of the layers of insulating materials as the holding member.

Method of making an electrical connecting member

A first terminal portion constructed by a plurality of contact pins of a first circuit board and a second terminal portion constructed by a plurality of contact pins of a second circuit board are joined in a housing of a connector. The connector has a presser for applying a pressing force to a joint portion. The presser applies the pressing force, thereby joining the plurality of contact pins of the first terminal and the plurality of contact pins of the second terminal through soft metal projections. Thus, a joint area of the contact terminal portion can be increased and the reliability of the joining can be improved. Since the circuit boards are positioned, the terminal portions of the circuit boards can be accurately joined.

Circuit board connecting apparatus

A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical connection between said electrical joints with a biasing force which is exerted by an elastic member from at least one side of said electric circuit component so that the biasing force is exerted consecutively from an intermediate position of connecting area where said joints are located to the periphery of said connecting area.

Electrical connections using deforming compression

An electrical connecting member for use in an electrical connection for connecting a first electrical circuit component on a side thereof and a second electrical circuit component on another side thereof, said electrical connecting member comprising: a plurality of layers each layer having a plurality of conductive members and an insulative holder for holding said plurality of conductive members, wherein said plurality of conductive members are arranged such that each conductive member has one end exposed on one surface of said layer and another end exposed on another surface of said layer, and makes electric contact with at least one of a conductive member immediately below and a conductive member immediately above, but does not contact conductive members laterally offset thereof, and wherein said conductive members have diameters that are substantially equal to each other, between said one surface of said layer and said another surface of said layer; and said plurality of layers are stacked such that said plurality of conductive members in one layer are connected with said plurality of conductive members in another layer, and are held by said insulative holder with a different pitch shifted slightly from said plurality of conductive members in another layer. It is a further object to provide an electrical member and an electrical circuit device which employ such an electrical connecting member.

Circuit member and electric circuit device with the connecting member

A semiconductor optical device is provided with a photo-electric conversion unit having plural photo-electric conversion elements and is entirely sealed by a sealing member. The photo-electric conversion elements are connected to external leads with electrical connectors. The distance D between a planar outer surface and a photoelectric conversion area satisfies the equation, D.gtoreq./2.multidot.l/tan .theta., where .theta. is a critical angle of total reflection of the sealing member with respect to air and l is the maximum length of said photoelectric conversion area.

Semiconductor photo-sensor and method for manufacturing the same

An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes 1B, to be porous or, in the alternative, annealed to soften the exposed portions.

Electrical connecting member

A method for producing an electrical circuit member includes the steps of positioning and arranging first and second electrical circuit parts having plural electrical connecting portions to be spaced and oppose each other, preparing an electrical connecting member having a plurality of electrical conductive members, each of which extends from one side of a holding member of an electrical insulating material therethrough to an opposite side of the holding member and is held in the holding member so that opposing ends of the electrical conductive member protrude from opposite sides of the holding member, and applying an adhesive to at least one side of the electrical connecting member including the electrical conductive members. The electrical connecting member with the adhesive is inserted between the first and second electrical circuit parts, and a pressing force is applied so that the first and second electrical parts contact the ends of the electrical conductive members.

Method for forming an electrical circuit member

An electrical circuit member comprises an electrical connecting member, said electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members embedded at predetermined intervals within said holding member, each of said plurality of electroconductive members being insulated with said electrically insulating material and also having the ends of said electroconductive member exposed on both surfaces of said holding member; and an electrical circuit part, said electrical circuit part having connecting portions to be connected to said electroconductive member or said wiring pattern exposed on both surfaces of said holding member, and being connected to at least one surface of said holding member.

Probe method for measuring part to be measured by use thereof and

An electrical connecting member, one surface of which is connected to a connecting section of a first electrical circuit member and another surface of which is connected to a connecting section of a second electrical circuit member. The electrical connecting member includes a holding member formed of an electrically insulative member. The holding member has a plurality of recess holes. The connecting member also includes a plurality of electrically conductive members provided in the electrically insulative member, insulated from each other. One end of the electrically conductive members is exposed on one surface of the holding member to be connected to the connecting section of the first electrical circuit member. Another end of the electrically conductive members is exposed on another surface of the holding member to be connected to the connecting section of the second electrical circuit member.

Method of manufacturing electrical connecting member

In a method for manufacturing a semiconductor photo-sensor, an assembly including a photoelectric conversion element having a photoreceiving section, and a lead terminal having an inner lead connected to the photoelectric conversion element by a bonding wire is provided. A light transmitting member is also provided within the cavity spaced apart from the photoelectric conversion element and at a light-incident side of the photoelectric conversion element, the light transmitting member having an inner surface facing an upper surface of the photoelectric conversion element and an outer surface opposite the inner surface. The photoelectric conversion element, the inner lead and the bonding wire are sealed by introducing a light transmitting resin into the cavity so as to provide a relation l&lt;2.multidot.(d.sub.1 +d.sub.2).multidot.tan.theta..sub.1, wherein l is a length of the photoreceiving section of the photoelectric conversion element, d.sub.1 is a thickness of the light transmitting resin above the upper surface of the photoelectric conversion element, d.sub.2 is a thickness of the light transmitting member, and .theta..sub.1 is a total reflection angle of the outer surface of the light transmitting member.

Method for manufacturing a semiconductor photo-sensor

A method for checking a part to be measured, by using an electric connection member having a holder made of electrically insulative material and a plurality of electrically conductive members embedded within the holder with being insulated from each other, both ends of the electrically conductive members being exposed on both surfaces of the holder in such a manner that the both ends are flush with or protruded from the both surfaces of the holder; an electric circuit member having connection portions; and a measured part having connection portions. At least one of the ends of the electrically conductive members exposed on one surface of the holder is electrically connected to one of the connection portions of the electric circuit member and at least one of the ends of the electrically conductive members exposed on the other surface of the holder is electrically connected to one of the connection portions of the measured part. The electric feature and/or system feature of the measured part are measured by using the electric circuit member. The measurements are effected by repeatedly using the same electrically conductive member contributing to the electrical connection for the electric connection member, by plural times.

Method and apparatus for checking parts to be measured using a belt-like

A process for preparing an electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members equipped in the holding member under the state mutually insulated from each other, one end of the each electroconductive member being exposed at one surface of the holding member, and the other end of the each electroconductive member being exposed at the other surface of the each holding member, the process having the following steps, namely the step of forming a matrix having the state where the holding member is in contact with a base member for supporting the holding member the step of irradiating a high energy beam on the matrix from the holding member side to remove the holding member, thereby forming a plurality of holes the step of filling an electroconductive material which becomes the electroconductive member into the plurality of holes formed and the step of removing the base member.

Process for preparing electrical connecting member

A method of manufacturing an electrical connecting member having a holding member formed of an electrically insulative material, and a plurality of electrically conductive members provided in a mutually insulated state in the holding member, one end of each of the electrically conductive members being exposed on one surface of the holding member and the other end of each of the electrically conductive members being exposed on the other surface of the holding member, includes the steps of providing photosensitive resin which provides the holding member on a base body, applying light to the photosensitive resin through a photomask forming a predetermined pattern to thereby expose the photosensitive resin to the light, developing the photosensitive resin to form a plurality of apertures in the photosensitive resin, thereby exposing the base body, leaving the photosensitive resin through which the base body has been exposed in a heated atmosphere and/or a negative pressure atmosphere for a predetermined time, etching the exposed portions of the base body to thereby form recesses communicating with the apertures, filling the apertures and the recesses with an electrically conductive material which provides the electrically conductive members, and removing the remaining portions of the base body.

Growing community of inventors

Yokohama, Japan

Tetsuo Yoshizawa