Shin-etsu Chemical Co., Ltd.

Tetsuo Yoshida

Yoshio Fujimura

Minoru Takei

An epoxy resin composition comprising an epoxy resin, a curing agent, a substantially pure alpha-alumina filler, and a silicone-modified epoxy or phenol resin is useful in encapsulating semiconductor devices. The composition can be molded and cured into a product having improved thermal conductivity and moisture resistance.

Semiconductor encapsulating epoxy resin compositions and semiconductor

A silicone composition adapted for impregnation of electronic parts comprising a vinyl group-containing organopolysiloxane, an organopolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule and a peroxide compound. The peroxide compound is soluble in both organopolysiloxanes and is contained in an amount of from 0.1 to 10 parts by weight per 100 parts by weight of the total of the organopolysiloxanes. The composition has a viscosity which is sufficient to allow easy impregnation, and is in the range of from 20 to 400 centistokes at 25.degree. C.

Growing community of inventors

Takasaki, Japan

Tetsuo Yoshida