Mitsubishi Electric Corporation

Ricoh Company, Ltd.

Tetsuo Yamashita

Takashi Ikeda

Tomohiro Hieda

Masaomi Miyazawa

Koichi Masuda

Tetsuya Tazawa

Mituharu Tabata

Koji Yamaguchi

Yoshiyuki Nakagawa

Tadashi Nakamura

Fumihiro Hasegawa

Takuya Takahashi

Yoshitaka Otsubo

Takahide Tadokoro

Hiroki Muraoka

Junichi Takami

Soichiro Yokota

Satoshi Sawaguchi

Shinichi Sumiyoshi

Mitsuhiro Shirota

Masahiko Itoh

Yuka Kihara

Reiji Morioka

Hiroomi Motohashi

Kohji Oshikiri

Seiji Hirakawa

Keisuke Tomomura

Kiichiroh Saitoh

Miyuki Oda

Kouji Yamaguchi

Fumiko Sakoh

Noriyuki Shiota

Masatomo Hatta

Yuusuke Ohta

Yosuke Kawamura

Hideyuki Ogata

Keichi Ochiai

Toshiya Yamauchi

Minoru Ishii

A semiconductor device includes a semiconductor element, a base plate, and a plurality of contact materials. The base plate has a front surface holding the semiconductor element and a rear surface to which a cooling body to cool the semiconductor element is attachable. The plurality of contact materials are discretely arranged on the rear surface of the base plate. The plurality of contact materials are materials for bridging a gap on a heat dissipation path between the base plate and the cooling body. The plurality of contact materials each have a volume based on a bowed shape of the rear surface of the base plate. From among the plurality of contact materials, a contact material at a concave of the bowed shape has a greater volume than a contact material at a convex of the bowed shape.

Semiconductor device and semiconductor device manufacturing method

According to the present invention, a semiconductor device includes a substrate having a metallic pattern formed on a top surface of the substrate, a semiconductor chip provided on the metallic pattern, a back surface electrode terminal in flat plate form connected to the metallic pattern with a wire, a front surface electrode terminal in flat plate form, the front surface electrode terminal being in parallel to the back surface electrode terminal above the back surface electrode terminal, extending immediately above the semiconductor chip, and being directly joined to a top surface of the semiconductor chip, a case surrounding the substrate and a seal material for sealing an inside of the case.

Method of manufacturing a semiconductor device

According to the present invention, a semiconductor device includes a semiconductor chip, resistance of which changes in accordance with temperature, an external resistor connected in series with the semiconductor chip and a detector configured to detect, while a first voltage is applied between both ends of a series circuit formed by the semiconductor chip and the external resistor, a second voltage applied between both ends of the external resistor, wherein the detector calculates a temperature of the semiconductor chip from the second voltage.

Semiconductor device and power conversion device

A distance measuring device includes a first measurer, a second distance measurer, and circuitry. The first distance measurer measures a distance to a target object; and outputs first distance information indicating a measured distance when the distance measurement is performed under a condition that satisfies a distance measurement condition, but outputs the first distance information indicating a predetermined value when the distance measurement is performed under a condition that does not satisfy the distance measurement condition. The second distance measurer measures a distance to the target object and outputs second distance information indicating the measured distance. When the first distance information indicates the predetermined value and the second distance information satisfies a predetermined condition, the circuitry makes alteration such that the distance measurement condition is relaxed. When the distance measurement condition is altered, the first distance measurer measures a distance to the target object again.

Distance measuring device, moving system, and distance measurement method

Semiconductor device and method of manufacturing the semiconductor device

A floor-positioned air-conditioning apparatus including a housing including a fan and a heat exchanger; a forward blowing control member rotatably arranged at a forward air outlet formed in a housing front surface at a position near a housing top surface; and an upward blowing control member rotatably arranged at an upward air outlet formed near the housing front surface are included. The forward blowing control member closes the forward air outlet and the upward blowing control member closes the upward air outlet during operation stop. The forward blowing control member closes the forward air outlet and the upward blowing control member is rotated and opens the upward air outlet during cooling operation. The upward blowing control member closes the upward air outlet and the forward blowing control member is rotated and opens the forward air outlet during heating operation.

Floor-positioned air-conditioning apparatus

A semiconductor device includes a semiconductor element and a ceramic circuit substrate on which the semiconductor element is mounted. The ceramic circuit substrate includes a ceramic substrate having one surface and the other surface facing each other, a metal circuit board joined to the one surface of the ceramic substrate and electrically connected to the semiconductor element, and a metal heat-dissipation plate joined to the other surface of the ceramic substrate. The metal circuit board is greater in thickness than the metal heat-dissipation plate. A surface of the metal heat-dissipation plate on a side opposite to the ceramic substrate is larger in area than a surface of the metal circuit board on a side opposite to the ceramic substrate. Thereby, a semiconductor device capable of suppressing warpage of the ceramic substrate can be achieved.

Semiconductor device

A floor-standing air-conditioning apparatus includes a lower air inlet, an air outlet having an air outlet opening, a heat exchanger that is provided in the body, a crossflow fan that is provided in the body and produces a flow of air in which the air that has flowed into the body passes through the heat exchanger and is guided to the air outlet, a drain pan that is provided below the heat exchanger in the height direction of the body. The heat exchanger includes a front heat exchanger and a rear heat exchanger, a pair of which form a V shape with their lower ends being in contact with, or in proximity to, each other, and are arranged so that the crossflow fan is positioned between the front heat exchanger and the rear heat exchanger.

Floor-standing air-conditioning apparatus

An information processing apparatus includes a receiving unit receiving data input to one or more apparatuses; a data storage unit storing the data with a determined display position thereof in a display screen; a log storage unit storing a data change as a log; an association unit monitoring a communication status of a communication with the one or more apparatuses, and associating information indicating an apparatus where a communication error occurs and a timing when the communication occurs with the log; a recording unit recording video of the data change displayed in the display screen from when the communication error occurs until when the communication is recovered for an apparatus; and a transmission unit transmitting the video from an event when the communication error occurs until an event when the communication is recovered and the log to the apparatus.

Information processing apparatus, information processing method, and information processing system

An upper suction port is formed in a main-body upper part of an air-conditioning apparatus main body, a suction opening part is formed in a front grill disposed on a main-body front face of the air-conditioning apparatus, a suction opening whose opening is directed upward is formed by consecutively providing an air guide wall inclined downward inside the main body on the upper edge of the suction opening, and the suction opening is located between a part, in the main-body height direction, lower than a straight line passing through a rotation center of an impeller and a closest contact point between the impeller and a front-face heat exchanger and a part, in the main-body height direction, higher than a straight line parallel with the straight line and passing through the impeller and a tongue part of a stabilizer.

Wall-mounted air-conditioning apparatus

An image processing apparatus includes an image acquiring unit that acquires an image of a subject imaged by an image capturing lens; a face detecting unit that detects face information corresponding to a person's face from the image acquired by the image acquiring unit; an image angle-of-view calculating unit that calculates an angle of view of a portion including the face in the image based on the face information detected by the face detecting unit; and a correction necessity determining unit that determines whether distortion correction of the image is need to be performed, based on the angle of view calculated by the image angle-of-view calculating unit and distortion characteristics of the image capturing lens.

Image processing apparatus, image processing method, and computer program product

A communication terminal or system is provided with a processor that calculates a transmission data size that is suitable to a detected state of a network, and analyzes contents of image data for transmission to determine an image parameter that should be prioritized. The communication terminal or system encodes the image data for transmission into encoded image data, based on the calculated transmission data size and the image parameter that should be prioritized.

Apparatus, system, and method of transmitting encoded image data, and recording medium storing control program

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Tokyo, Japan

Tetsuo Yamashita