Hoya Corporation

Avanstrate Inc.

Shinkawa Ltd.

Yamaha Robotics Co., Ltd.

Unicafe Inc.

Tetsuo Takano

Kazuaki Hashimoto

Akihiro Koyama

Satoshi Ami

Hiroshi Kikuchi

Toru Maeda

Tomonori Nakamura

Yoshiatsu Yokoo

Kiyoshi Morita

Mitsugu Imai

Tomoyuki Goto

Mikiko Morishita

Rieko Kaneko

Kin Ri

A surface treatment apparatus applies a hydrophilic treatment to a bonding surface of a target object bonded to a bonded object using hydrogen bonding, the hydrophilic treatment being applied prior to the bonding. The surface treatment apparatus includes a support base and a spray nozzle. The support base supports a surface of the target object opposite to the bonding surface, the target object being one or more target objects. The spray nozzle causes dew condensation temporarily on the bonding surface by spraying, onto the bonding surface of the target object supported by the support base, humidified air having a water vapor pressure equal to or higher than a saturated water vapor pressure corresponding to a temperature of the bonding surface.

Surface treatment apparatus and manufacturing apparatus for semiconductor device

A mounting apparatus for manufacturing a semiconductor device by bonding a semiconductor chip () to a mounted object that is a substrate () or another semiconductor chip () is provided. The mounting apparatus includes: a stage () on which the substrate () is placed, a mounting head () that is capable of moving relative to the stage () and bonds the semiconductor chip () to the mounted object, and an irradiation unit (that irradiates, from a lower side of the stage (), an electromagnetic wave transmitting through the stage and heating the substrate (). The stage () has a first layer () formed on an upper surface side, and the first layer () has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction.

Mounting apparatus and method for manufacturing semiconductor device

The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO, 5% to 20% by mass of AlO, 6% to 30% by mass of NaO, and 0% to less than 8% by mass of LiO. The glass substrate may also contain 0% to 2.6% by mass of CaO, if necessary. The glass substrate has an etching characteristic in which the etching rate is at least 3.7 &#x3bc;m/minute in an etching environment having a temperature of 22&#xb0; C. and containing hydrogen fluoride with a concentration of 10% by mass.

Cover glass and method for producing cover glass

A cover glass having a compressive-stress layer on the principal surfaces thereof, and having a glass composition containing 50% to 70% by mole of SiO, 3% to 20% by mole of AlO, 5% to 25% by mole of NaO, more than 0% by mole and less than or equal to 2.5% by mole of LiO, 0% to 5.5% by mole of KO, and 0% to less than 3% by mole of BO. Also disclosed is a method for producing a cover glass which includes: (i) preparing molten glass by melting a glass raw material; (ii) forming the prepared molten glass into a plate-like shape by a down-draw process and thereby obtaining a glass substrate; and (iii) forming a compressive-stress layer on the surface of the glass substrate.

Cover glass and method for producing same

The present invention provides a glass substrate of a cover glass for a portable electronic device. The glass substrate includes a front face, a back face and an edge face. The edge face is at least partially formed by means of an etching treatment. A compressive stress layer, formed by means of an ion-exchanging method, is disposed on each of the front and back faces of the glass substrate. The compressive stress layer has the same thickness both in a planar-directional center part thereof and in a planar-directional end part thereof on each of the front and back faces of the glass substrate.

Glass substrate of cover glass for portable electronic device, image display unit for portable electronic device, portable electronic device and method of manufacturing glass substrate of cover glass for portable electronic device

A collimatorfor an input light, a collimatorfor an output light, a collimatorfor a branched light, a collimatorfor an inserted light and a wavelength selecting filterare provided on a common substrate, and mirrorstofor correcting an optical path or prisms XXXX to XXXX capable of producing the same advantages are provided on the optical paths between the collimatorstoand the wavelength selecting filterrespectively. By adjusting the mirrors or prisms, the shift of the optical axis between the collimators is corrected.

Optical module formed on common substrate for branching an optical signal

Disclosed are tea extracts which do not form precipitates or change their taste even after long-term preservation, as well as a method of producing the same. Carrageenan is added to tea extracts to suppress formation of insoluble matters.

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Tokyo, Japan

Tetsuo Takano