The Furukawa Electric Co., Ltd.

Nihon Kohden Corporation

Shoda Techtron Corp.

Fujitsu Corporation

Nippon Electric Co., Ltd.

Nec Corporation

Hoya Corporation

Tetsuo Suzuki

Yoshio Kawakami

Hitoshi Igarashi

Yoshimi Kubo

Kazuhiro Nakiri

Shigeaki Shimizu

Kazumasa Ito

Naoki Kobayashi

Yoshinori Ueda

Toshiharu Yamashita

Masahiro Takeuchi

Hideki Fujisaki

Yoshio Arai

Yoshiharu Harada

Yasuhiro Wakimoto

Toshiyuki Asai

Kumi Sugiyama

Sinji Nishikawa

Takashi Kizaki

Hiroaki Oonuma

Naoki Amatatsu

Wataru Komatsu

Jiongxun Chen

A physiological parameter calculation device includes an acquiring section, a failure sensing section and a calculation section. The acquiring section acquires a plurality of signals corresponding to physiological information of a subject. The failure sensing section senses a failure of the plurality of elements. The calculation section calculates a physiological parameter based on the plurality of signals acquired by the acquiring section and a first algorithm or a second algorithm. The calculation section calculates the physiological parameter: based on the first algorithm when the failure sensing section does not sense a failure in an element for acquiring a signal used for the first algorithm among the plurality of elements, and based on the second algorithm when the failure sensing senses that a failure occurs in an element for acquiring a signal used for the first algorithm among the plurality of elements.

Physiological parameter calculation device and non-transitory computer-readable medium

A vital sign information processing system includes a sensor configured to be attached to a living body, and an information acquisition apparatus configured to acquire vital sign information of the living body through the sensor. A first memory is disposed in the sensor and stores first site information indicative of a site at which the sensor is to be used. A second memory is disposed in the information acquisition apparatus and stores second site information indicative of a site at which the information acquisition apparatus is to be used. A processor disposed in the information acquisition apparatus causes the information acquisition apparatus to perform notification when the first site information and the second site information are not matched.

Sensor and vital sign information processing system

A pulse oximeter includes one or more processor and one or more memory storing instructions. When the instructions are executed by the one or more processor, the one or more processor causes the pulse oximeter to acquire a first signal corresponding to an intensity of first light having a first wavelength and a second signal corresponding to an intensity of second light having a second wavelength, set a presumptive value of an arterial oxygen saturation, acquire an arterial blood component signal and a venous blood component signal corresponding to the presumptive value from the first signal and the second signal, acquire an index value corresponding to a phase difference between the arterial blood component signal and the venous blood component signal, and calculate the arterial oxygen saturation based on a variation of the index value associated with a change of the presumptive value.

Pulse oximeter

First and second sensors attached to a living body are connected to first and second input connectors respectively. An analog-to-digital converter converts a first analog voltage signal input from the first sensor through the first input connector into a first digital voltage signal. A first voltage-to-current converter converts the first digital voltage signal into a first analog current signal. A first interface connector outputs a second analog voltage signal and the first analog current signal, the second analog voltage signal being input from the second sensor through the second input connector. A physiological information processing apparatus has a second interface connector through which the first analog current signal and the second analog voltage signal are input to the physiological information processing apparatus.

Physiological information processing system

A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.

Method of manufacturing glass substrate

A voltage monitoring circuit includes: a ripple filter configured to output an output voltage from which a ripple component included in an input voltage, which is input from a voltage source, has been removed; a load configured to operate with the output voltage as a supply voltage and output a first signal through the operation; a comparator configured to compare an electric potential of the output voltage with an electric potential of the first signal and output a second signal when the electric potential difference is equal to or less than a predetermined threshold value; and a control circuit configured to reduce the electric potential of the first signal under the condition that the second signal is input thereto.

Voltage monitoring circuit

A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate.

Chamfering apparatus for chamfering glass substrates

A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.

A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate.

Method of manufacturing disk substrate

Provided are connection methods and a heat treatment apparatus to be used in the method capable of readily applying heat treatment to a fusion-spliced portion of a connection line which is formed by fusion-splicing optical fibers of different kinds and capable of finishing the heat treatment with no excess or insufficiency. In the connection methods, after fusion-splicing the optical fibers of different kinds having different MFDs, the heat treatment is carried out to match the MFDs. At the same time, a dummy connection line of dummy optical fibers of different kinds is prepared, which is the same combination as the connection line of the optical fibers of different kinds to which the heat treatment is applied. While measuring connection loss in the dummy connection line directly or indirectly, the heat treatment is applied to the dummy connection line as well as the connection line. When a measured value of the connection loss in the dummy connection line lowers below a preset decision value of the time to finish the heat treatment, the heat treatment is finished. It is possible to readily finish the heat treatment at an appropriate timing without giving an excessive or insufficient heat treatment.

Method for connecting optical fibers, and heat treatment apparatus used therefor

An optical fiber splicing method is provided for largely reducing an optical loss in a splice and eliminating a varying outer diameter and bending deformation. This splicing method splices opposing end faces of two optical fibers by fusion, and heats a formed fusion splice to match mode field diameters of the two optical fibers in the fusion splice, wherein the two optical fibers are fixed with an axial tension applied or not applied to the fusion splice, after the formation of the fusion splice, before the fusion splice is heated.

Optical fiber splicing method

The connecting method of different kind optical fibers of the present invention is a connecting method able to improve the strength of connecting portions of the different kind optical fibers of different mode field diameters. In this connecting method, connecting ends of the different kind optical fibers removing their coating therefrom are mutually butted and fusion-spliced by gripping the coating in a step (S ). Next, the mode field diameters of different kind optical fiber connecting portions are conformed to each other by the heat treatment of a step (S ). This heat treatment is taken within a low dust space having a clean degree of 1000 or less in class. Thus, the heat treatment is taken under an environment in which foreign matters floated around the connecting portions of the different kind optical fibers are very small. Therefore, it is possible to restrain a crack from being caused by burning the foreign matters into the connecting portions. Accordingly, strength deterioration of the connecting portions of the different kind optical fibers caused by the crack can be prevented.

Connecting method of different kind optical fibers

Three current supply lines and connection terminals thereof for respectively driving the light emitting diodes on the probe side are arranged in a light emitting diode driving circuit on the measurement apparatus body side, a pair of driving switches Sw A, Sw B and Sw A, Sw B for constant current having contact points to be switched to the electric power source side or the ground side are respectively connected with the two current supply lines among the three current supply lines, and switching operation signal supply lines A, A and B, B are arranged for successively and continuously driving the light emitting diodes by supplying a switching operation signal for switching the contact points on the electric power source side or on the ground side to the pair of driving switches for constant current.

Current driving system of light emitting diode

A single-chip microcomputer connectable to an external memory for expanding the address space, and having a first mode of operation in which the available memory region is both the region of an internal ROM and the external memory, and having a second mode of operation in which the available memory region is the region of the external memory only. An inhibiting device is provided for inhibiting the switching from the second mode to the first mode, thereby ensuring that the contents of the internal ROM cannot be read-out.

Growing community of inventors

Tokyo, Japan

Tetsuo Suzuki