Taiyo Yuden Co., Ltd.

Taiyo Yudenco., Ltd.

Tetsuo Shimura

Yasuyuki Inomata

Koichiro Morita

Yousuke Nakada

Kenji Matsumoto

Kazuya Sato

Chie Kawamura

Minoru Ryu

Yoshiki Iwazaki

Yosuke Nakada

Katsuya Taniguchi

Yukihiro Konishi

Masaki Mochigi

Tomoya Hagiwara

Kunihiko Nagaoka

Yoichiro Ogata

A multilayer ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers, one end of each of the plurality of internal electrode layers being exposed from the multilayer chip, an external electrode that is provided on an end face of the multilayer chip and is electrically connected to the one end of at least some of the plurality of internal electrode layers and includes a glass component, the end face being an end of the multilayer chip in a direction in which the plurality of internal electrode layers extend. The external electrode includes a crystal contacting or extending into the glass component at an interface between the external electrode and the end face of the multilayer chip. The crystal includes an element that is the same as at least one of elements included in the plurality of dielectric layers.

Multilayer ceramic electronic device, circuit substrate and manufacturing method of multilayer ceramic electronic device

A multilayer ceramic capacitor includes a laminated body in which dielectric layers and internal electrodes are laminated alternately. The dielectric layer includes a first phase that contains calcium strontium zirconate titanate as a main component thereof and a second phase that contains barium zirconate as a main component thereof. At a cross section of the dielectric layer, a line parallel to the direction in which the dielectric layers and the internal electrodes are laminated contacts the boundaries between the first phase and the second phase once or more on average, thereby the statistically averaged contact number N of such a line with the boundaries determined by a prescribed procedure being 1.0 or greater.

Multilayer ceramic capacitor and manufacturing method therefor

A ceramic electronic device includes a multilayer structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, wherein a main component of the dielectric layers is (Ba, Sr, Ca)(Zr, Ti)O, wherein a Ba concentration and a Ca concentration have variation in at least one of crystal grains in the dielectric layers.

Ceramic electronic device and manufacturing method of the same

A multi-layer ceramic capacitor has a structure where the dispersion, nd, of average grain size of the dielectric grains constituting the dielectric layer (a value (D90/D10) obtained by dividing D90 which is a grain size including 90% cumulative abundance of grains by D10 which is a grain size including 10% cumulative abundance of grains) is smaller than 4.

Multi-layer ceramic capacitor and method of manufacturing the same

A ceramic capacitor includes a multilayer structure, wherein a main component of dielectric layers is ceramic expressed by a general formula ABO(0.995&#x2264;m&#x2264;1.010), wherein the dielectric layers include a rare earth element Re as a first sub-component by 2.0 mol to 5.0 mol when converted into ReO/2, include Mg as a second sub-component by 1.0 mol to 3.0 mol when converted into MgO, include V as a third sub-component by 0.05 mol to 0.25 mol when converted into VO/2, include Si as a fourth sub-component by 0.5 mol to 5.0 mol when converted into SiO, include an alkali earth metal element M as a fifth sub-component by 0.1 mol to 5.0 mol when converted into MCO, on a presumption that an amount of the ceramic is 100 mol, wherein a ratio Si/V is 30 or less.

Ceramic capacitor, circuit substrate and manufacturing method of ceramic capacitor

The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.

Electronic component with interposer

In an embodiment, an electronic component with metal terminals includes: an electronic componenthaving a component bodyof roughly rectangular solid shape, as well as external electrodesprovided on the ends thereof in the first direction d, respectively; and metal terminalsprovided in sets of two on each external electrodeEach metal terminalhas a first planar partand a second planar partoriented differently from the first planar partthe first planar partis connected to each external electrodein a manner facing one face of the component bodyand the second planar partis positioned in a manner facing at least partially, across a clearanceanother face adjoining the one face of the component bodywhile being fixed to the component bodyby an adhesiveprovided in the clearance

Electronic component with metal terminals

In an embodiment, an electronic component fuseincludes: (1) an insulator sleevehaving a hollow partthat opens to the exterior at both ends; (2) a conductor elementhaving a fusible partwhose cross-section is smaller than the cross-section of the hollow part, a first engagement partprovided at one end of the fusible part, and a second engagement partprovided at the other end of the fusible part, where the fusible partis positioned in the hollow part, the first engagement partand the second engagement partare disposed on the respective ends of the insulator sleeve; (3) a first terminalhaving a first connection partconnected to the first engagement part; and (4) a second terminalhaving a second connection partconnected to the second engagement part

Electronic component fuse and fused electronic component module

A multilayer ceramic capacitor includes a laminate constituted by internal electrode layers of different polarities alternately layered via dielectric layers, wherein the multilayer ceramic capacitor is such that the dielectric layers contain ceramic grains whose primary component is BaTiO, the ceramic grains contain Mo, Mn, rare earth R, and at least one of V and W, and the average valence number of Mo in the ceramic grains is 4.50 to 5.50. The multilayer ceramic capacitor can offer excellent service life characteristics and sufficiently suppress leak current even when the thickness of the dielectric layer is 0.8 &#x3bc;m or less.

[object Object]

An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Electric circuit device

A multilayer ceramic capacitor has a laminate including dielectric layers laminated alternately with internal electrode layers of different polarities, wherein the dielectric layer contains ceramic grains having Ba, Ti, and X (wherein X represents at least one type of element selected from the group consisting of Mo, Ta, Nb, and W) and a variation in the concentration distribution of X above in the ceramic grain is within &#xb1;5%. The multilayer ceramic capacitor can offer excellent service life characteristics even when the thickness of the dielectric layer is 0.8 &#x3bc;m or less, as well as excellent bias characteristics.

Multilayer ceramic capacitor

A multi-layer ceramic capacitor has a structure where its dielectric layers are constituted by a sintered compact that contains a mol of ReO, b mol of SiO, c mol of MO, d mol of ZrO, and e mol of MgO (where Re is a rare earth element, M is a metal element (except for Ba, Ti, Re, Si, Zr, Mg, and rare earth elements), and x is a valance) per 100 mol of BaTiO, and a, b, c, d, and e mentioned above which indicate the mol numbers of respective constituents per 100 mol of BaTiOare 0.1&#x2266;a&#x2266;1.0, 0.1&#x2266;b&#x2266;1.5, 0.1&#x2266;c&#x2266;0.4, 0&#x2266;d&#x2266;1.0, and 0&#x2266;e&#x2266;0.03, respectively.

Multi-layer ceramic capacitor

A dielectric ceramic is formed with sintered grains constituting the dielectric have an average grain size of 0.2 to 1.0 &#x3bc;m and an oxygen defect concentration of 0.2 to 0.5%. An acceptor element is added to the dielectric ceramic by no more than 0.5 mol per 100 mol of the primary component of BaTiO. The oxygen defect concentration is temporarily increased by reduction and sintering, after which the oxygen defect concentration is reduced through the subsequent re-oxidization process. Crystal strain generated in the re-oxidization process increases the dielectric constant.

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Takasaki, Japan

Tetsuo Shimura