Taiyo Yuden Co., Ltd.

Idemitsu Kosan Company, Limited

Japan Science and Technology Corporation

Tetsuo Saji

Kazuhiro Watanabe

Eiji Mugiya

Masaya Shimamura

Tatsuro Sawatari

Takehiko Kai

Kenzo Kitazaki

Yohei Ichikawa

Katsuyoshi Hoshino

Yuki Endo

Yuichi Sugiyama

Hiroshi Kokado

Seiichiro Yokoyama

Naoyuki Tasaka

Gohki Nishimura

Masaki Naganuma

Nobuaki Matsuo

Takashi Matsuda

Yutaka Nagai

Atsushi Tsunoda

Shigeo Sakurai

Kumar Nabeen Shrestha

A filter circuit includes: a variable filter that is connected between a common terminal and a node and configured to change a passband thereof; a receive switch connected between a receive terminal, from which a reception signal in a first band is output, and the node; and a transmit switch connected between a transmit terminal, to which a transmission signal in a second band different from the first band is input, and the node.

Filter circuit, front end circuit, and module

A module comprising: a first transmit filter that passes a transmission signal of a first band; a first receive filter that passes a reception signal of the first band; a second transmit filter that passes a transmission signal of a second band; a second receive filter that passes a reception signal of the second band; a third transmit filter that passes a transmission signal of a third band; and a third receive filter that passes a reception signal of the third band, wherein a transmit band of the first band overlaps with at least a part of a receive band of the second band, a receive band of the third band does not overlap with the transmit band of the first band or a transmit band of the second band, and the third receive filter is located between the first receive filter and the second receive filter.

Front end circuit, module, and communication device

One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.

Circuit module

A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.

High frequency circuit module in which high frequency circuits are embedded in a multilayer circuit substrate

A front end circuit includes: a first antenna terminal from/to which transmission/reception signals of a low band (LB) and a high band (HB); a second antenna terminal from/to which a transmission/reception signal of a middle band (MB) is output/input; an LB terminal to/from which the transmission/reception signal of the LB is input/output, an MB terminal to/from which the transmission/reception signal of the MB is input/output; an HB terminal to/from which the transmission/reception signal of the HB is input/output; and a separating circuit that passes the transmission and reception signals of the LB and suppresses the transmission and reception signals of the MB and the HB between the first antenna terminal and the LB terminal, and that passes the transmission and reception signals of the HB and suppresses the transmission and reception signals of the LB and the MB between the first antenna terminal and the HB terminal.

A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area.

Multilayer circuit substrate

A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area.

There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

Circuit module and method of producing circuit module

A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction.

High frequency circuit module

A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.

Communication module

A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

Multilayer substrate

A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.

Circuit module and method of producing the same

A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

Circuit module having electrical shield

A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate.

Growing community of inventors

Tokyo, Japan

Tetsuo Saji