Hitachi, Ltd.

Tetsuo Ookawa

Hiroyuki Kojima

Hidemi Sato

Mariko Urushibara

To provide a method having stable high polishing efficiency in the CMP of an LSI wafer and means for reducing the amount of use of consumable items such as a polishing liquid and a pad, an electric field is applied to the abrasive grains on a pad to attract the abrasive grains into a diffusion layer in the polishing liquid solvent near the surface of the pad, thereby holding the abrasive grains in the diffusion layer.

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Yokohama, Japan

Tetsuo Ookawa