Nippon Kayaku Kabushiki Kaisha

Taiyo Ink Manufacturing Co., Ltd.

Nippon Polytech Corp.

Tetsuo Ohkubo

Minoru Yokoshima

Masayuki Kiyomoto

Kazuyoshi Nawata

Hideaki Hattori

Kazunori Sasahara

Masahisa Kakinuma

Yoneji Sato

Shigeru Komori

Yoko Baba

Kazuhiro Yoshida

There is disclosed a photo-imaging resist ink containing (A) an unsaturated group-containing polycarboxylic acid resin which is a reaction product of (c) succinic anhydride with an additive reaction product of (a) an epoxy resin with (b) an unsaturated group-containing monocarboxylic acid, wherein (a) the epoxy resin is represented by the following formula (1): ##STR1## wherein M stands for ##STR2## n is at least 1 on the average; and m is 1 to n on the average. The resist ink is excellent in developability and photosensitivity, while the cured product thereof is excellent in flex resistance and folding resistance, and well satisfactory in adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, etc.

Photo-imaging resist ink and cured product thereof

The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom. In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.

Resist ink composition and cured article prepared therefrom

Disclosed herein is a resin composition or a solder resist resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photopolymerization initiator (E).

Resin composition and solder resist composition

The present invention relates to an unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof; a composition comprising the resin and a cured product of the resin or the composition. The composition according to the present invention is developable with an aqueous alkaline solution and suitable for a solder resist composition which is excellent in heat resistance, solvent resistance, adhesion, electric insulation property and storage stability.

Unsaturated group-containing polycarboxlic acid resin, resin composition

Disclosed herein are i) a resin composition comprising (A) a di-(meth)acrylic acid ester of a carbonate diol having an average molecular weight of 500 to 3000 or of an addition compound of the carbonate diol with an .epsilon.-caprolactone, (B) a monoethylenically unsaturated monomer and optionally, (C) an initiator of photopolymerization, ii) a di-(meth)acrylic acid ester of an addition compound of a carbonate diol having an average molecular weight of 500 to 3000 with an .epsilon.-caprolactone and iii) a di(meth)acrylic acid ester represented by the formula: ##STR1## wherein R.sup.1 represents an alkylene group having 4 to 10 carbon atoms, R.sup.2 represents a hydrogen atom or a methyl group, the mean values of a and b are 0 to 5, respectively, the mean sum of a plus b is 0.5 to 5 and the mean value of l is 1 to 10.

Photocurable di-(meth)acrylic acid ester resin coating composition

A silicon-urethane (meth) acrylate which is a reaction product of an isocyanato-alkylsilane compound represented by the following general formula: ##STR1## wherein R.sub.1 represents an alkylene group having 2 to 5 carbon atoms, R.sub.2 represents an alkyl group having 1 to 5 carbon atoms or alkoxy group having 1 to 5 carbon atoms, and R.sub.3 and R.sub.4 each represents an alkyl group having 1 to 5 carbon atoms, and a hydroxyl group-containing ester of (meth) acrylic acid, a resin composition and a coating material for optical glass fiber comprising said silicon-urethane (meth) acrylate.

Novel silicon-urethane (meth) acrylate, and resin composition and

Diesters of (meth)acrylic acid and resin compositions comprising the same

Disclosed herein are (i) a resin composition comprising (A) a di-(meth)acrylic acid ester of a carbonate diol having an average molecular weight of 500 to 3000 or of an addition compound of the carbonate diol with an .epsilon.-caprolactone, (B) a monoethylenically unsaturated monomer and optionally, (C) an initiator of photopolymerization, (ii) a di-(meth)acrylic acid ester of an addition compound of a carbonate diol having an average molecular weight of 500 to 3000 with an .epsilon.-caprolactone and (iii) a di-(meth)acrylic acid ester represented by the formula: ##STR1## wherein R.sup.1 represents an alkylene group having 4 to 10 carbon atoms, R.sup.2 represents a hydrogen atom or a methyl group, the mean values of a and b are 0 to 5, respectively, the mean sum of a plus b is 0.5 to 5 and the mean value of l is 1 to 10.

Di-(meth)acrylic acid ester, resin composition comprising the same and

Novel organophosphates of the general formula: ##STR1## wherein R.sub.1 and R.sub.2 each represents H or CH.sub.3, m is a numeral of 1-5 and n is a numeral of 1-2, and adhesives comprising them.

Novel organophosphate and adhesive comprising it

A novel (meth)acrylate represented by the general formula [I]: ##STR1## wherein R.sub.1 stands for a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R.sub.2 and R.sub.3 each stand for a hydrogen atom or a methyl group; the mean value of m is 1 to 10 and the mean value of n is 1 to 10 and a resin composition comprising the same.

Novel (meth)acrylate and resin composition comprising the same

Phosphates having one to three (meth)acrylate groups

Disclosed herein are ethylenically unsaturated compounds represented by the formula: ##STR1## wherein R represents a hydrogen atom or a methyl group, on the average m and n respectively represent a value of 1 to 5, on the average p represents a value of 1 to 6, on the average q and r represent respectively a value of 0 to 3, on the average s represents a value of 0 to 5, p+q+r+s is 6: q+r is a value of 0 to 3, p+s is a value of 3 to 6 and the average value of mp+nq is 1 to 30, and a method for producing the same.

(Meth) acrylate esters of dipentaerythritol caprolactone condensates

Acetal glycol diacrylates of the formula: ##STR1## wherein R.sub.1 represents H or CH.sub.3 and R.sub.2 represents CH.sub.3, C.sub.2 H.sub.5 or C.sub.3 H.sub.7, and a process for producing them are provided.

Growing community of inventors

Ube, Japan

Tetsuo Ohkubo