Denka Company Limited

Denki Kagaku Kogyo Kabushiki Kaisha

Tetsuo Noguchi

Masanori Matsumoto

Yuichi Shindo

Kohhei Nishino

Satoshi Ishii

Yoshinari Kurokawa

Takeshi Ohtsuka

Koichi Ozawa

Yuichi Shimokoba

This maleimide-based copolymer contains 40-60 mass % of aromatic vinyl monomer units, 5-20 mass % of vinyl cyanide monomer units, and 35-50 mass % of maleimide monomer units, and is such that a 4 mass % tetrahydrofuran solution of the copolymer has a transmittance of 90% or more for light having a wavelength of 450 nm at an optical path length of 10 mm, and the residual maleimide-based monomer amount is less than 300 ppm. This maleimide-based copolymer preferably further contains 0-10 mass % of unsaturated dicarboxylic acid anhydride monomer units, and preferably has a glass transition temperature of 165° C. or higher.

Maleimide-based copolymer, method for producing same, and resin composition obtained using same

The present invention provides a maleimide-based copolymer, a method for producing same, and a resin composition obtained using same. This maleimide-based copolymer contains 40-60 mass % of aromatic vinyl monomer units, 5-20 mass % of vinyl cyanide monomer units, and 35-50 mass % of maleimide monomer units, and is such that a 4 mass % tetrahydrofuran solution of the copolymer has a transmittance of 90% or more for light having a wavelength of 450 nm at an optical path length of 10 mm, and the residual maleimide-based monomer amount is less than 300 ppm. This maleimide-based copolymer preferably further contains 0-10 mass % of unsaturated dicarboxylic acid anhydride monomer units, and preferably has a glass transition temperature of 165&#xb0; C. or higher.

A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.

Copolymer for improving methacrylic resin heat resistance

Provided is a copolymer for improving heat resistance of aromatic vinyl-vinyl cyanide based resin which can achieve preservation of excellent transparency of the aromatic vinyl-vinyl cyanide based resin, improvement in heat resistance, and a molded product having excellent appearance, by adding the copolymer to the aromatic vinyl-vinyl cyanide based resin. A copolymer for improving heat resistance of an aromatic vinyl-vinyl cyanide based resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.

Copolymer for improving heat resistance of aromatic vinyl-vinyl cyanide resin

Provided is a maleimide copolymer which exhibits an excellent hue, an effect of imparting high heat resistance, and excellent kneadability. Specifically provided is a maleimide copolymer which comprises 50 to 60 mass % of a styrene monomer unit, 30 to 50 mass % of a maleimide monomer unit, and 0 to 10 mass % of an unsaturated dicarboxylic anhydride monomer unit, and which has a weight-average molecular weight (Mw) of 90,000 to 130,000 and a residual maleimide monomer content of 300 ppm or lower.

Maleimide copolymer, process for the production thereof, and heat resistant resin compositions containing same

Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m&#xb7;K. Also, disclosed is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition.

Growing community of inventors

Ichihara, Japan

Tetsuo Noguchi