Denso Corporation

Tetsuo Nakano

Yukihiro Maeda

Takashi Nagasaka

Yasutomi Asai

Yuji Ootani

An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.

Electronic apparatus and method for manufacturing the same

A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

Electrical device having metal pad bonded with metal wiring and manufacturing method thereof

At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

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Toyoake, Japan

Tetsuo Nakano