Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Cable, Inc.

Fuji Fiber Glass Co., Ltd.

Tetsuo Kumazawa

Makoto Kitano

Ryuji Kohno

Akihiro Yaguchi

Naotaka Tanaka

Asao Nishimura

Ichiro Anjoh

Susumu Kasukabe

Yasuhiro Motoyama

Kunio Matsumoto

Hidetaka Shigi

Naoto Ban

Akihiko Ariga

Yuji Wada

Takayoshi Watanabe

Terutaka Mori

Makoto Shimaoka

Shuji Shibuya

Hideki Tanaka

Akira Nagai

Shuji Eguchi

Mamoru Mita

Hiromichi Suzuki

Satoshi Nakamura

Yasuo Miyadera

Tatsuya Nagata

Kazuyuki Fukuda

Nae Yoneda

Atsushi Fujioka

Yasutoshi Yagiu

Masayoshi Tsugane

Takao Kawamura

Kunio Aiki

Atsushi Sasayama

Hiroshi Fukushima

Yukihiro Izumida

Kenichi Fukuzawa

Hiroaki Doi

Toshiya Yuhara

Hisao Iitsuka

Takeo Takemoto

Masaru Nakazawa

Doi Hiroaki

Tadashi Nagai

Eiichi Adachi

Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

Semiconductor device

Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.

A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

Lead frame and semiconductor device

A connecting structure of an optical fiber to an optical waveguide includes a circular cylindrical holder having a bore with a circular cross-section communicating one end thereof to the other. The protecting layer removal end of the optical fiber is inserted into the bore. An end plane of the protecting layer removal end and a side plane of the holder are co-planar to be connected to an end surface of an optical waveguide.

Connecting structure of optical fiber to optical waveguide

Lead frame and semiconductor device encapsulated by resin

A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.

Encapsulated semiconductor device package having holes for electrically

An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.

Electronic component, electronic component assembly and electronic

An optical coupling apparatus including a light emitting diode, a lens, an optical isolator and an optical fiber disposed on a common optical axis is improved in the optical coupling efficiency. The individual optical elements are roughly adjusted in the respective positions and fixed, and then a precise and fine adjustment is effectuated by plastically deforming a portion of a holder for supporting the lens or the optical isolator and/or by adjusting inclination of the holder. The holder imparted with the fine adjustment capability can be implemented as a lens holder.

Optical coupling apparatus and manufacturing method of the same, and

A collimated-beam generating device using a semiconductor laser includes a two-lens system in which light converged by a first lens is converted into a collimated beam by a second lens, whereby a distance between the semiconductor laser and the first lens is made large, assembly of the device is made easy, and a collimated beam having a small beam diameter can be produced.

Semiconductor light emitting device and apparatus using the same

An optical fiber apparatus having an optical fiber jacket guide for receiving and guiding an optical fiber therethrough to enable proper optical coupling with an optical component of an opto-electronic package device. An optical fiber core extends through the jacket guide and has a coating material coated thereon and extending within at least a part of the jacket guide. At least a part of the coating material within the jacket guide has an irregular peripheral surface and adhesive within the jacket guide bonds at least the coating material and the jacket guide.

Opto-electronic device and method for producing the device

Growing community of inventors

Ibaraki-ken, Japan

Tetsuo Kumazawa