Panasonic Corporation

Tetsuo Ito

Toshiyuki Fukuda

Takao Ochi

Yukihiro Nakazawa

Tomio Takegawa

A resin molding moldwith a cavityhas a resin injection portfrom which a molding resinis injected toward the cavity, and an air release portfrom which air from the cavityis released during resin injection. Not only the resin injection portbut also the air release portis formed in a top surface portionof the cavity. Thus, even if a resin burr remains in the resin injection portor the air release port, it can be prevented from adhering to an external terminalA provided on a front surface portionof the substrate

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

The convenience of operation is improved and the occurrence of connection failure between a connection-target terminal of an electric appliance and a connection terminal is reduced without requiring a complicated arrangement such as a fitting structure. A microphone charging device has a dustproof shutter provided so as to be movable with a microphone device setting/drawing-off operation between a covering position covering a charging terminal portion and an exposure position exposing the charging terminal portion, a torsion spring applies a fundamental urging force to the shutter between the covering position and exposure position, and plate springs apply additional urging force to the shutter in addition to the fundamental urging force in an additional urging section provided between the covering position and exposure position and thereby sets the shutter in an additionally urged state. When the shutter reaches the exposure position, the plate springs release the shutter from the additionally urged state.

Connection device to which electric device is connected and having dust-proof function

A production equipment includes a substrateplaced inside and having a plurality of semiconductor elementsmounted thereon, and a resin molding moldhaving a cavity. The moldhas resin injection portsand air release ports. Each of the resin injection portsis formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element. Each of the air release portsis formed around each of the resin injection ports

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Growing community of inventors

Osaka, Japan

Tetsuo Ito