Kabushiki Kaisha Toshiba

Toshiba Materials Co., Ltd.

Shibaura Institute of Technology

Other

Kyocera Corporation

Tokyo Shibaura Electric Co., Ltd.

Kawatetsu Mining Co., Ltd.

Tetsuo Inoue

Tetsuhiko Mizoguchi

Takao Kusaka

Yuji Sakai

Takashi Hino

Shuichi Saito

Takehito Yamada

Hiroshi Tomita

Yasuhiro Shirakawa

Junichi Akiyama

Hajime Takeuchi

Hiromi Fuke

Yasumasa Ooya

Akira Sato

Katsutoshi Nakagawa

Toshiro Sato

Shigeru Takekado

Atsushi Yumoto

Kazushi Tanimoto

Kazunori Moriya

Yasutaka Fukuda

Makoto Imamura

Yoshihito Tachi

Toshio Shimaoogi

Shigeru Yatabe

Tomoko Komai

Toshirou Sato

Takao Ito

Yasuo Ohtsubo

Mitsuaki Koyama

Takao Muraoka

Keiko Higashi

Taiju Yamada

Yoshinao Takada

Mari Shimizu

Yasuhiro Yamaguchi

Mamoru Baba

Tomohiro Sugano

Shigeru Kakekado

Masaharu Suzuki

A component comprises a film containing yttrium oxide. A cross section of the film has a first portion, a second portion, and a third portion, and the first to third portions are separated from each other by 0.5 mm or more. A Vickers hardness B1 measured in the first portion, a Vickers hardness B2 measured in the second portion, a Vickers hardness B3 measured in the third portion, and an average value A of the Vickers hardnesses B1 to B3 are numbers satisfying 0.8A≤B1≤1.2A, 0.8A≤B2≤1.2A, and 0.8A≤B3≤1.2A.

Component and apparatus of manufacturing semiconductor

An aluminum nitride film includes a polycrystalline aluminum nitride. A withstand voltage of the aluminum nitride film is 100 kV/mm or more.

Aluminum nitride film, method of manufacturing aluminum nitride film, and high withstand voltage component

A component includes a film containing polycrystalline yttrium oxide. In an X-ray diffraction pattern of the film, a ratio I/Iof a maximum intensity Iof a peak attributed to monoclinic yttrium oxide to a maximum intensity Iof a peak attributed to cubic yttrium oxide satisfies an expression: 0&#x2264;I/I&#x2264;0.002.

Component and semiconductor manufacturing device

A non-contact type power receiving apparatus including: a power receiving coil having a spiral coil; a rectifier; a secondary battery; an electronic device operated by being supplied with direct voltage from the secondary battery, wherein a composite magnetic body is provided to at least one portion between the secondary battery and the spiral coil, and a portion between the electronic device and the spiral coil. The composite magnetic body includes at least first and other layers of magnetic sheets through an insulating layer in which when a relative magnetic permeability of the first magnetic sheet provided to a side of the spiral coil is &#x3bc;d, a thickness of the first magnetic sheet is tu, an average relative magnetic permeability of the other magnetic sheets other than the first magnetic sheet is &#x3bc;u, and a total thickness of the other magnetic sheets is tu, the composite magnetic body satisfies the following relations: &#x3bc;d&#xb7;td&#x2266;60 [mm]; and &#x3bc;u&#xb7;tu&#x2267;100 [mm].

Non-contact type power receiving apparatus, electronic equipment and charging system using the power receiving apparatus

A white light source includes: an insulating substrate; a light-emitting diode chip provided on the insulating substrate and that emits ultraviolet light with a wavelength of 330 nm to 410 nm; and a phosphor layer formed to cover the light-emitting diode chip, including a red emitting phosphor, a green emitting phosphor, and a blue emitting phosphor as a phosphor, and the phosphors are dispersed in a cured transparent resin, wherein when it is assumed that the shortest distance between a surface of the phosphor layer and a peripheral portion of the light-emitting diode chip is t(mm) and the mean free path defined by the following expression (1) is L(mm), the t and L satisfy 3.2&#x2266;t/L. [Expression/(&#xd7;&#x3c3;)&#x2003;&#x2003;(1)(n: number of phosphors per unit volume of the phosphor layer (pcs/mm), and &#x3c3;: average cross section area of a phosphor in the phosphor layer (mm)).

White light source, backlight, liquid crystal display apparatus, and illuminating apparatus

An electronic apparatus () includes a power receiver () and an electronic apparatus main body (). The power receiver () includes a power receiving coil () having a spiral coil, a rectifier () and a secondary battery (). The electronic apparatus main body () includes an electronic device () and a circuit board (). A magnetic foil () is arranged in at least one position between the spiral coil () and one of the secondary battery (), the rectifier (), the electronic device () and the circuit board ().

Power receiver, and electronic apparatus and non-contact charger using same

An electronic apparatus () includes a power receiving device () and an electronic apparatus main body (). The power receiving device () includes a power receiving coil () having a spiral coil, a rectifier (), and a secondary battery (). The electronic apparatus main body () includes an electronic device () and a circuit board (). A magnetic foil () is arranged in at least one position between the spiral coil () and the secondary battery (), the rectifier (), the electronic device (), or the circuit board (). The magnetic foil () has a &#x3bc;r'&#xb7;t value expressed as the product of the real component &#x3bc;r&#x2032; of relative permeability and the plate thickness t of 30000 or larger.

Power receiving device, and electronic apparatus and non-contact charging system using the same

Disclosed is an electronic apparatus () comprising a power receiving device () and an electronic apparatus main body (). The power receiving device () comprises a power receiving coil () having a spiral coil, a rectifier () and a secondary battery (). The electronic apparatus main body () comprises an electronic device () and a circuit board (). A magnetic foil () is arranged in at least one position between the spiral coil () and the secondary battery (), the rectifier (), the electronic device () or the circuit board (). The magnetic foil () has a value expressed as the product of the saturation flux density MS and the thickness t, namely Ms&#xb7;t, of not less than 15.

Power receiving device, and electronic apparatus and non-contact charger using the same

A light emitting deviceincludes a light emitting diode, a phosphor layer containing phosphors that emit a visible light by being excited by a light emitted from the light emitting diode, and a reflector disposed to surround the light emitting diode. A portion of 50% or more in an area ratio of a reflecting surface of the reflector is formed as a scattering surface with a mean square inclination (&#x394;q) (0.1 mm) in a range of not less than 0.003 nor more than 0.03.

Light-emitting device having scattering reflector with preset square average inclination

A planar magnetic deviceincludes a first magnetic layerand a second magnetic layerthat are made of a mixture of a magnetic powderand a resin, and a planar coildisposed between the magnetic layers. When the planar coilhas an adjacent winding interval W between the potionsof the coil and the magnetic powderhas a maximum particle size L, planar magnetic devicesatisfies the relationship W&#x3e;L. In the planar magnetic devicehaving the above structure, fine magnetic powder that can produce a high inductance fills the spaces between the adjacent windings. Thus, the invention can achieve a high-performance planar magnetic device, such as a thin inductor.

Planar magnetic device and power supply IC package using same

A planar magnetic deviceincluding a first magnetic layer, a second magnetic layer, and a planar coildisposed between the first magnetic layerand the second magnetic layer, wherein magnetic particleshaving a shape ratio S/L of 0.7 to 1 when a length of a long axis is L and a length of a short axis orthogonal to the long axis is L are filled in a gap W between coil wirings of the planar coil. According to the planar magnetic device, it is possible to realize a planar magnetic device such as an inductor reduced in height by using fine particles that enable to effectively obtain a large inductance value.

Flat magnetic element and power IC package using the same

An electromagnetic interference preventing component () includes a high-permeability magnetic film in high-frequency in which a real number component &#x3bc;' of complex relative permeability at a transmission band frequency of an electronic device () incorporating the electromagnetic interference preventing component () is 10 or more, tan &#x3b4; (=&#x3bc;&#x2033;/&#x3bc;&#x2032;) is 0.1 or less, and a ferromagnetic resonance frequency (fr) is 1.5 times or more of the transmission band frequency. The electromagnetic interference preventing component () having the high-permeability magnetic film in high-frequency is disposed in the electronic device () having an electromagnetic wave transmitting function, as to selectively decrease the electromagnetic field intensity in directions in which the electromagnetic waves radiated by an electromagnetic wave transmitting part such as an antenna () are not required.

Electromagnetic interference preventing component and electronic device using the same

An inductance element () comprises a core () having a multilayer body () composed of magnetic alloy thin ribbons () and an insulating coating layer () which covers the peripheral surface of the multilayer body without being bonded thereto, and a coil () wound around the core (). The magnetic alloy thin ribbons () are stacked in a non-adhered state or with a flexible insulating adhesive layer therebetween. Having such a structure, the inductance element can stably attain good characteristics even when it is small-sized or made short.

Inductive device and method for manufacturing same

A strain sensor includes a sensor section having a magnetic material provided on one surface of a conductor, the magnetic material being formed integrally with the conductor and having a magnetic strain constant with an absolute value larger than 1&#xd7;10, a fixing mechanism which fixes at least a part of the sensor section, an inductor disposed in a surface side of the sensor section which is opposite the surface on which the magnetic material is provided, the inductor being disposed opposite and away from the sensor section, and a detection unit which detects the amount of deformation of the sensor section caused by stress applied thereto on the basis of a change in inductance of the inductor.

Strain sensor

This invention provides a surface mounting type planar magnetic device comprised of upper ferrite magnetic film, lower ferrite magnetic film and a planar coil interposed therebetween. For applying surface mount technology, an opening is formed in the upper ferrite magnetic film above a coil terminal portion and then, an external electrode conductive with the coil terminal portion through the opening is formed on the upper ferrite magnetic film. Further, this surface mounting type planar magnetic device is of a thin structure and can be mounted on the surface of a printed board. Its power loss is small, its inductance is large, its frequency characteristic is excellent, the disparity of the characteristic is small and its reliability is excellent.

Surface mounting type planar magnetic device and production method thereof

Growing community of inventors

Yokohama, Japan

Tetsuo Inoue