Sony Corporation

Other

Tetsuo Abe

Tadashi Hattori

Hiroyuki Wada

Nobuhiko Umezu

Koichi Tatsuki

Akifumi Ooshima

Shigeo Kubota

Minoru Takeda

Makoto Takatoku

Seiichi Nakagawa

Yuichi Aki

Hiroyuki Tamaki

Ayumu Taguchi

Setsuo Norioka

Yukiyasu Sugano

Naoki Date

Yoshimi Hirata

Toshiaki Miyokawa

Kouki Okawauchi

Yoshiyuki Noguchi

Eiji Isomura

Hironori Fujita

Tomohide Tokumaru

Makoto Uragaki

Tomohiro Ishiguro

Masataka Ebe

Yasuyuki Kato

Morio Misono

A testing apparatus using a scanning electron microscope for enabling tests and measurements on any part of a test subject in a nondestructive way without being limited by a size of the test subject, which is, a testing apparatususing a scanning electron microscope for performing tests and measurements on any part of a test subject in a nondestructive way by using a scanning electron microscope, comprising a local vacuum formation portionfor forming a local vacuum region by blocking around a part to be tested of the test subject from the outside air, wherein the local vacuum formation portion comprises an exhaust portion for exhausting to form a partial vacuum region, a float meansfor floating the whole local vacuum formation portion above the test subject by emitting a compressed gas to an outer circumference portion of the local vacuum formation portion and a length measuring meansfor measuring a distance between the test subject and the local vacuum formation portion for controlling floating of the local vacuum formation portion by the float means.

Testing apparatus using scanning electron microscope

The state of a polysilicon film formed by excimer laser annealing an amorphous silicon film is to be evaluated. When the amorphous silicon film is annealed to form a polysilicon film, linearity or periodicity presents itself in the spatial structure of the film surface of the polysilicon film formed depending on the energy applied to the amorphous silicon during annealing. This linearity or periodicity is processed as an image and represented numerically from the image by exploiting the linearity or periodicity. The state of the polysilicon film is checked based on the numerical results.

Polysilicon evaluating method, polysilicon inspection apparatus and method for preparation of thin film transistor

A polysilicon film evaluation apparatus is provided which enables objective automatic evaluation of the status of a polysilicon film, as formed to a high accuracy in a contact-free fashion. To this end, there is provided a polysilicon film evaluation apparatus including a stage on which to set a substrate W carrying a polysilicon film, an optical system for observation with the visible light for illuminating the visible light on a substrate W on the stage to photograph a surface image of the polysilicon film on the substrate W to effect auto-focusing, an optical system for observation with UV light for illuminating the UV light on the substrate on the stage to acquire a surface image of the polysilicon film of the substrate, auto-focused using the optical system for observation with the visible light, and an evaluating unit for evaluating the linearity and periodicity of a spatial structure of the film surface of the polysilicon film, from a surface image of the polysilicon film obtained by the optical system for observation with UV light, to evaluate the status of the polysilicon film based on the results of evaluation of the linearity and periodicity.

Apparatus for evaluating polysilicon film

An apparatus for inspecting the outward appearance of each of IC packages stored in an embossed tape includes a drive wheel having an outer periphery about which the embossed tape is wound. The drive wheel is rotatable in a vertical plane for moving the embossed tape. A pair of cameras are so mounted as to face the outer periphery of the drive wheel at its upwardly and downwardly moving portions, respectively, and are used to produce two different images of each IC package from two different angles through a cover tape bonded to the embossed tape for enclosing the IC packages. The apparatus prevents any diffused reflection of light by the cover tape and any inclination of each IC package during its inspection.

IC package inspection apparatus

Growing community of inventors

Kanagawa, Japan

Tetsuo Abe