Mitsubishi Heavy Industries Limited

Tetsunori Miyoshi

Takeshi Yamada

Naoki Yamamoto

Yuya Tanaka

Masahiro Aoyama

Akira Kitano

Takeshi Kadomasu

The aim of the present invention is to provide a processing device and a processing method, with which it is possible to improve processing accuracy. A processing device processes a work piece which integrally includes a plate-shaped first curved-surface section and a plate-shaped planar-surface section that extends from the edge of the first curved-surface section in a bending manner. Furthermore, the processing device includes a first clamp device which includes a contact part that makes contact with the first curved-surface section, and a pressing part that presses the first curved-surface section in the direction of the contact part, and which restricts movement of the first curved-surface section in the plate thickness direction; a second clamp device which is movable in the plate thickness direction of the planar-surface section and supports the planar-surface section; and a machining device which machines the first curved-surface section.

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Tokyo, Japan

Tetsunori Miyoshi