Mitsubishi Materials Corporation

Tetsuji Yamashita

Hanako Hata

Tsutomu Takahashi

Takashi Kimura

Naoki Shimomae

A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.

CMP conditioner

In the electrodeposited abrasive wheel of the abrasive tool according to the present invention, plural mound parts which are upheaved at the central domain of base metal in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer is formed on a base metal and plural ultra abrasive grains are adhered only to each mound parts by electrodeposited metal phase and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part and top of the mound parts at the small abrasive-grain-layer parts Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range. At the time of grinding, only ultra abrasive grains contact to grinding work piece, then high abutment pressure is maintained, and sharpness and the discharge performance of ground wastes are good.

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Iwaki, Japan

Tetsuji Yamashita