Dai Nippon Printing Co., Ltd.

Tetsuji Ogata

Hideto Sakata

Kiyoshi Imaizumi

A noncontact IC tag label includes: a band-shaped label base material inclusive of a release surface formed at least at one end of the base material and releasably treated in advance, and a non-release surface; an electroconductive layer formed on the non-release surface of the band-shaped label base material and including a required antenna pattern; and an IC chip mounted on one face of the electroconductive layer. The electroconductive layer and the IC chip are shrouded by a surface protection sheet via a pressure-sensitive adhesive layer. A thermoadhesive resin layer bonded onto the non-release surface of the band-shaped label base material is provided on an opposite face of the electroconductive layer including the antenna pattern, with respect to the surface protection sheet. Also, the pressure-sensitive adhesive layer is bonded onto the non-release surface and release surface of the band-shaped label base material.

Noncontact IC tag label, airline baggage tag label, and manufacturing method for noncontact IC tag label

This invention provides a thin type of noncontact IC tag label that allows materials costs to be reduced without using an antenna-supporting base film. The noncontact IC tag label includes an electroconductive layer of a required antenna pattern shape, an IC chip mounted on one face of the electroconductive layer, and a surface protection sheet supporting the electroconductive layer and the IC chip from a side of the one face of the electroconductive layer via a first pressure-sensitive adhesive layer. An adhesive resin layer having the same shape as the antenna pattern shape of the electroconductive layer is provided on the other face of the electroconductive layer. The adhesive resin layer is temporarily bonded in separable manner onto a release paper formed from paper or a plastic base material.

Noncontact IC tag label and method of manufacturing the same

An IC tag label includes an inlet substrate, an IC chip protection sheet,which is mounted on one surface of the inlet substrateand an antenna pattern and an IC chip which are mounted on the other surface of the inlet substrate. An adhesive layer is mounted on the other surface of the inlet substrate to cover the antenna pattern and IC chip. An opening, which serves as a clearance for the IC chip, is formed in a portion of the IC chip protection sheet-, the portion corresponding to the IC chip.

IC tag label

An IC tag labelA includes an inlet substrate; an antenna patternand an IC chipwhich are provided on one surface of the inlet substrate; and an adhesive layerwhich is mounted on the other surface of the inlet substrate. A release paperis attached to the adhesive layer. An openingwhich serves as a clearance for the IC chipis provided in a portion of the release paperand adhesive layer, the portion corresponding to the IC chip

A noncontact IC tagcomprises a base film, an antenna patternand an IC chipthat are on the base film, and a surface-protective membercovering the antenna patternand the IC chipBetween the surface-protective memberand the base filmare present two strip membersthat are placed in parallel on both sides of the IC chipso that a bet-shaped spaceis made between them. The IC chipis positioned in this belt-shaped spaceFor the strip members, it is preferable to use, paper, a plastic film, or a magnetic sheet with a uniform thickness of 50 to 250 &#x3bc;m.

Growing community of inventors

Tokyo-to, Japan

Tetsuji Ogata