Fujitsu Corporation

Tetsuji Ishikawa

Masakazu Kobayashi

Osamu Saito

Masayuki Kitajima

Hideaki Terauchi

Chie Terauchi

Osamu Saitou

A power-demand-value calculating system includes a storage device and an arithmetic device. The storage device stores data of combinations of temperatures and power result values. The arithmetic device selects data equal to or higher than a predetermined temperature from the storage device and, calculates, when the power result values corresponding to the temperatures of the selected data are smaller than a power calculation value which is calculated from a regression formula derived from the data of the combinations and the temperatures of the selected data, a maximum power demand value based on the temperatures equal to or higher than the predetermined temperature and the regression formula.

Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program

A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Joining method and reflow apparatus

The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Heating apparatus

A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

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Kawasaki, Japan

Tetsuji Ishikawa