Tdk Corporation

Tetsuji Hori

Masashi Sano

Hisayoshi Watanabe

Takayuki Nishizawa

Takayasu Kanaya

Hiromichi Umehara

Hideyuki Yatsu

Yuji Matsuura

Hiroki Aritomo

Akira Miyasaka

Youji Hirao

The present invention relates to a method of making a mask for patterning a thin film. The method includes a step of forming an inorganic material, which is resolvable into alkali solution, on a substrate; a step of forming the inorganic material in a predetermined pattern; and a step of narrowing the inorganic material with the alkali solution to form the mask.

Method of making a mask, method of patterning by using this mask and method of manufacturing a micro-device

The present invention relates to a method of forming a metal in a concave portion of a substrate. The method includes a step of preparing a substrate having a concave portion; a step of applying a liquid coating member on the substrate and filling in and solidifying the concave portion with the coating member; a step of covering the coating member with a resist; a step of forming a penetrating hole that penetrates the resist in a position of the concave portion of the substrate; a step of removing the coating member within the concave portion; and a step of filling a metal into a portion where the coating member has been removed.

Method of forming metal to a concave portion of a substrate, method of manufacturing a magnetic head and a magnetic head

Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic substrate and one or more layers formed thereon, and having the surface to be polished. The polishing method uses a retainer ring made of a ceramic material containing AlTiC.

Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same

An alumina-film-polishing composition is for use in chemical mechanical polishing of an object to be polished that includes an alumina film with an irregular surface, so as to planarize the irregular surface. The polishing composition contains an alumina abrasive grain, and a protection-film-forming agent for forming a protection film on the surface of each of the alumina film and the alumina abrasive grain. The protection-film-forming agent is a water-soluble polymer that has a weight average molecular weight within a range of 100 to 1,000,000 and that is obtained by polymerizing a monomer having at least one OH group or COOH group in its molecule.

Alumina-film-polishing composition and chemical mechanical polishing method using the same

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Tokyo, Japan

Tetsuji Hori