Hitachi, Ltd.

Hitachi Computer Engineering Co., Ltd.

Tetsuhiro Yokayama

Keiji Fujikawa

Hiroo Inoue

Junji Narita

Yooichi Fujiwara

Terumi Saitoo

Yoouichi Fukuoka

A system for producing parts/substrate assemblies each of which includes a substrate such as a ceramic substrate and a plurality of parts such as LSIs mounted on the substrate. After the LSIs for one lot of the production have been checked for excess or deficiency, etc. by a collating device, they are formed with solder bumps and then inspected. The LSIs are automatically arranged on empty work pallets as parts kits by a kit setting apparatus, and the work pallets on each of which the corresponding LSIs have been arranged as the parts kit are moved into a stocker. A host computer gives a command for mounting the LSIs on the ceramic substrate on which they can be mounted, on the basis of information indicating the stocked pallet and information indicating the progress of the ceramic substrate. An LSI mounting apparatus reads the serial No. of the introduced ceramic substrate, and requests the stocker to deliver the work pallet on which the associated LSIs have been arranged as the parts kit.

Method of producing parts/substrate assemblies

Growing community of inventors

Hadano, Japan

Tetsuhiro Yokayama