Mitsui Minings & Melting Co., Ltd.

Tetsuhiro Matsunaga

Joe Nishikawa

Hajime Watanabe

Tetsuro Sato

Makoto Dobashi

Toshifumi Matsushima

Susumu Takahashi

Takuya Yamamoto

Hideaki Matsushima

Kenichiro Iwakiri

Toshiko Yokota

Kensuke Nakamura

Hiroyuki Kon

A composite metal foil is provided comprising a porous metal foil comprising a two-dimensional network structure composed of a metal fiber, and a primer provided on at least a part of the interior and/or periphery of pores of the porous metal foil. According to the present invention, it is possible to obtain a composite metal foil which has a desired function imparted by a primer in addition to superior properties derived from a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Composite metal foil and production method therefor

A reinforced porous metal foil is provided including a porous portion comprising a two-dimensional network structure composed of a metal fiber and a reinforced portion which is substantially non-porous or less porous than the porous portion. The reinforced portion is composed of the same metal the metal fiber and is continuous and integral with the porous portion. Accordingly, it possible to provide a porous metal foil having superior properties at a low cost in a highly productive manner that is also suitable for continuous production.

Reinforced porous metal foil and process for production thereof

The porous metal foil of the present invention include a two-dimensional network structure composed of a metal fiber. This porous metal foil has a first side having a higher glossiness, and a second side having a lower glossiness located on the opposite side of the first side. The ratio of glossiness Gof the first side to glossiness Gof the second side, G/G, as measured at incident and reflection angles of 60 degrees in accordance with JIS Z 8741 (1997) is from 1 to 15. The present invention provides a highly useful porous metal foil which has a reduced difference in properties between both sides, in addition to the superior properties attributable to a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Porous metal foil and production method therefor

A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni&#x2014;Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof

A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/mand a tin layer having a thickness by weight of 5 to 40 mg/mstacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 &#x3bc;m.

Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layer

To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layeris an inorganic-oxide sputter film having a thickness of 1.0 &#x3bc;m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer

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Ageo, Japan

Tetsuhiro Matsunaga