Honda Motor Co., Ltd.

Keihin Corporation

Tetsu Miyamoto

Kengo Aoki

Ayumu Uno

Takeshi Otani

Toshikatsu Katagiri

Kenta Sugitate

Naoki Fujihara

Kentaro Yamada

Hiroto Kobayashi

Koichi Takahashi

Takashi Ikeda

Koichi Hasegawa

Satoko Ito

Daisuke Komazawa

Naoyuki Nakamura

Toru Hiranishi

Shinya Yanbe

Kazuo Maruyama

A temperature adjustment circuit includes a first temperature adjustment circuit and a second temperature adjustment circuit in which a switching part that is configured to switch between a circulation state where a heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and a non-circulation state where the heat-transfer medium is not circulated through the connection circuit.

Temperature adjustment circuit

A temperature adjustment circuit includes a first temperature adjustment circuit and a second temperature adjustment circuit in which a control device is configured to switch between a circulation state where a heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and a non-circulation state where the heat-transfer medium is not circulated through the connection circuit.

A vehicle includes a battery, an air conditioner, a first temperature adjustment circuit including a first pump and a chiller, a second temperature adjustment circuit including a second pump and a radiator, a coupling passage configured to connect the first temperature adjustment circuit and the second temperature adjustment circuit to form a coupling circuit, an electromagnetic switching valve configured to switch between a circulation state in which the heat medium can circulate through the coupling circuit and a non-circulation state in which the heat medium cannot circulate through the coupling circuit, a first temperature sensor configured to acquire a first temperature which is a temperature of the battery, and a control device configured to select any one mode of a plurality of modes in accordance with the first temperature.

Vehicle

A cooling structure of an electricity storage device includes a storage cell case, a plurality of storage cells, a plurality of cooling passages, an intake duct, an exhaust duct, a cooling air suction device, and a flow path resistance. The plurality of storage cells are accommodated in the storage cell case. The plurality of cooling passages are provided between the storage cells. The intake duct is connected to an upstream side of the storage cell case. The exhaust duct is connected to a downstream side of the storage cell case. The cooling air suction device is connected to the exhaust duct and configured to draw cooling air from the intake duct. The flow path resistance is provided between the plurality of cooling passages and the cooling air suction device to limit a flow of the cooling air from the intake duct to the cooling air suction device.

Cooling structure of electricity storage device

An electricity storage module includes a storage cell group, first and second end plates, a first restraining band, a second restraining band, and at least one intermediate plate. The first restraining band is provided to face a first side surface of the storage cell group and is connected to the first and second end plates to restrain the storage cell group. The first restraining band includes a first flat surface, a first bent portion, and a second bent portion. The second restraining band includes a second flat surface, a third bent portion, and a fourth bent portion. The at least one intermediate plate is disposed at an internal position in the storage cell group in a stacking direction. The first and third bent portions or portions in vicinities of the first and third bent portions are connected to the at least one intermediate plate.

Electricity storage module and electrically powered vehicle

A heat dissipating structure of a print circuit board to improve heat-dissipation efficiency for mounted electronic components while retaining required soldering strength is disclosed. The heat dissipation structure of a print circuit board comprising a stack of multiple layers including a mounting surface layer on which electronic components including heat generating components are soldered. On both sides of the print circuit board, inner vias bore surface layers but inner layers are not bored. Core vias bore the inner layers in the print circuit board but the surface layers are not bored. The inner vias and the core vias are positioned at the predetermined distance over the layer surface. Heat from heat generating components is conducted through the inner vias on surface layers and the core vias inside the circuit board to the outside, high efficiency of the heat-dissipation is achieved.

Heat dissipation structure of a print circuit board

Growing community of inventors

Wako, Japan

Tetsu Miyamoto