Dai Nippon Printing Co., Ltd.

Terutoshi Momose

Katsuya Sakayori

Tsuyoshi Yamazaki

Yoichi Hitomi

Michiaki Uchiyama

Toshihiko Takeda

Kazunori Oda

Shigeki Kawano

Tomoko Togashi

Shinji Kumon

Hiroshi Yagi

Yoko Nakamura

Kiyotaka Takematsu

Takayuki Ota

Shinichiro Takahashi

Hiroko Amasaki

Nobuhiro Sakihama

Hiroaki Miyazawa

Yoichi Miura

Kiyohiro Takachi

Kenro Hirata

Tooru Serizawa

Makoto Shimose

Taizo Hashimoto

Kazuto Okamura

Kazutoshi Taguchi

Kazunori Ohmizo

Youichi Nagai

Midori Chiba

Included are a plurality of first flow paths, and second flow paths arranged between adjacent ones of the first flow paths; and a layer including grooves constituting the first flow paths and the second flow paths, and a layer laminated on the insides of the grooves, and constituting inner surfaces of the first flow paths and the second flow paths.

Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber

A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.

Vapor chamber and electronic device

A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.

Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber

Vapor chamber with condensate flow paths disposed on wall parts

A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3&#xd7;10/% RH and 30&#xd7;10/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5&#xd7;10/% RH or less.

Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive

A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.

Substrate for suspension

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

Wet etched insulator and electronic circuit component

The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.

Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film

A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other. Thereby, the desired portions of the suspension can be grounded through this simple structure without adopting a complicated structure wherein additional special lines for grounding are not separately laid besides the lines, which are lines for connecting a magnetic head and a control circuit board to each other.

Magnetic head suspension

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer&#x2014;insulating layer&#x2014;second inorganic material layer or a layer construction of inorganic material layer&#x2014;insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

A magnetic head suspension includes an insulating base (), wiring parts () formed on one surface of the insulating base () including a conductive metal layer, an elastic metal plate () provided on the other surface of the insulating base (), and a wiring protecting layer () covering the wiring parts (). The wiring protecting layer () is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.

Magnetic head suspension with both protected wiring and unprotected wiring, in addition to terminals

The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer&mdash;insulating layer&mdash;conductive inorganic material layer or a laminate of conductive inorganic material layer&mdash;insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer. The patterning of the insulating layer by wet etching is carried out in a continuous form using a dry film resist; and, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.

Growing community of inventors

Shinjuku-ku, Japan

Terutoshi Momose