Showa Denko Packaing Co., Ltd.

Terutoshi Kumaki

Makoto Karatsu

Takashi Nagaoka

Wei He

Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity. [Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layerserving as an outer layer, a heat fusible resin layerserving as an inner layer, and a metal foil layerdisposed between both the two layers. The heat resistant resin layeris composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layerand the metal foil layerare bonded via an outer adhesive layercomposed of a cured film of an electron beam curable resin composition.

Growing community of inventors

Kanagawa, Japan

Terutoshi Kumaki