Kabushiki Kaisha Toshiba

Teruo Takeuchi

Satoshi Shimizu

Kazuhisa Iwashita

Tatsuo Tonedachi

Kazuhiro Inoue

Hiroaki Oshio

Tetsuro Komatsu

Gen Watari

Hidenori Egoshi

Mami Yamamoto

Naoya Ushiyama

Iwao Matsumoto

Takashi Arakawa

Yoshio Noguchi

Atsushi Takeshita

Toshihiro Kuroki

Kazuhiro Tamura

Masahiro Ogushi

Yuki Akamatsu

Toshihiro Komeya

A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Semiconductor light-emitting device and method for producing the same

A method for manufacturing a photocoupler includes: mounting light emitting devices and light receiving devices on a lead frame sheet; positioning the lead frame sheet with respect to a die by cutting off the one set of column portions from a linking portion and inserting a first pilot pin formed on the die into a second pilot hole; opposing the light emitting devices and the light receiving devices to each other; connecting the light emitting side coupling bars and the light receiving side coupling bars to each other on the die; forming a resin body so as to cover a pair of the light emitting device and the light receiving device; and cutting off the light emitting side lead frame portion from the light emitting column portion and cutting off the light receiving side lead frame portion from the light receiving column portion.

Method for manufacturing photocoupler, and photocoupler lead frame sheet

According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

LED module

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

LED package and method for manufacturing same

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 &#x3bc;m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

LED package, method for manufacturing LED package, and packing member for LED package

According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

LED package

According to one embodiment, an LED package includes (2&#xd7;n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2&#xd7;n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2&#xd7;n) lead frames and another terminal connected to each of lead frames of the (2&#xd7;n) lead frames other than the n lead frames. The resin body covers the (2&#xd7;n) lead frames and the n LED chips.

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

LED package and method for manufacturing the same

According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

Growing community of inventors

Kitakyushu, Japan

Teruo Takeuchi