Asahi Kasei Kogyo Kabushiki Kaisha

Asahi Kasei Kabushiki Kaisha

Teruo Katayose

Hiroji Oda

Yoshiyuki Ishii

Shozo Kinoshita

Takeshi Arai

Haruhisa Sasaki

The invention provides resin-having metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a (sequentially) multilayered wiring board produced by using the resin-having metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means.

Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device

A novel curable polyphenylene ether resin composition caontains (a) a curable polyphenylene ether resin containing at least a reaction product of a polyphenylene ether with an unsaturated carboxylic acid or an acid anhydride, (b) at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate, optionally (c) a resin composition comprising an epoxy resin and a curing agent and/or (d) a compound having at least one unsaturated double bond and at least one epoxy group and/or (e) a reinforcement material. The resin composition has excellent film-forming properties, resin flowability in pressing and storage stability. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition has excellent chemical resistance, heat resistance, dielectric properties and dimensional stability.

Curable polyphenylene ether and cyanurate resin composition and a cured

A novel curable polyphenylene ether resin composition is disclosed, which comprises (a) a curable polyphenylene ether resin having at least one group selected from the group consisting of an allyl group and a propargyl group and (b) at least one cyanurate. The resin composition has excellent storage stability, film-forming properties and melt moldability. If desired, a fire retardant, optionally together with an antimony-containing auxiliary fire retardant, and/or a reinforcement is incorporated into the resin composition in order to improve the fire retardance and mechanical properties of the resin composition, respectively. By curing the resin composition, a cured polyphenylene ether resin composition comprising a chloroform nonextractable polyphenylene ether resin component and a chloroform extractable, polyphenylene ether-containing component is obtained, which has excellent chemical resistance, electrical properties, dimensional stability and heat resistance. A laminate or composite structure comprising the cured polyphenylene ether resin composition and a metallic foil and/or a metallic substrate provides advantageous mechanical and electronic components.

Curable polyphenylene ether resin composition and a cured resin

A novel cured polyphenylene ether resin is disclosed comprising a chloroform nonextractable polyphenylene ether and a chloroform extractable polyphenylene ether. By subjecting the resin to pyrolysis gas chromatography, the resin is decomposed to form 3,5-dimethylphenol specifically. The chloroform extractable polyphenylene ether is contained in the resin in an amount of 0.01 to 20% by weight and comprises polyphenylene ether units substituted by an alkenyl group and/or an alkynyl group. The novel cured polyphenylene ether resin has excellent mechanical properties, electrical properties, heat resistance and chemical resistance. The cured polyphexylene ether resin is prepared by curing a novel curable polyphenylene ether resin comprising polyphenylene ether units substituted with an alkenyl groups and/or an alkynyl groups at a specific average substitution degree. The novel curable polyphenylene ether resin has not only excellent mechanical properties and desired electric properties such as a low dielectric constant and a low dielectric dissipation factor, but also excellent melt processability and storage properties.

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Sakura, Japan

Teruo Katayose