Tokyo Electron Limited

Daifuku Co., Ltd.

Murata Machinery, Ltd.

Tokyo Electron Yamanashi Limited

Ma Solutions Limited

Teruo Asakawa

Hiroaki Saeki

Keiichi Matsushima

Hiroo Ono

Tetsu Oosawa

Kenji Nebuka

Kazuhiko Sugiyama

Tetsu Osawa

Yoji Iizuka

Junichi Inoue

Noboru Hosaka

Tsutomu Hiroki

Takaaki Matsuoka

Shigeru Ishizawa

Masaki Narushima

Toshihiko Iijima

Yoshiaki Sasaki

Makoto Yamamoto

Masaki Kondo

Hirofumi Yamaguchi

Tetsu Ohsawa

Masaaki Kawaguchi

Hirokazu Narisawa

Kou Fujimura

Naoko Murata

Akira Machida

Noboru Masuoka

Supika Mashiro

Akiyoshi Shoujima

A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

Processing instructing device, processing instructing method, computer program and processing device

Provided is an operation limiting device which makes it possible to achieve more robust security and safety in processing of a workpiece by a processing apparatus. The operation limiting device limits operations relating to processing of a workpiece by a processing apparatus, and is provided with: an authentication unit for authenticating each of a plurality of users; a receiving unit for receiving an operation request or permission for said operation, from a plurality of authenticated users; an operation enabling unit for enabling an operation if an operation request or permission has been received from the plurality of authenticated users; and a releasing unit for releasing the operation enabled state set by the operation enabling unit if processing relating to the operation has terminated or if a predetermined period of time corresponding to the operation has elapsed.

Operation limiting device, operation limiting method, and storage medium

A production efficiency improving apparatus includes a first communicating means for communicating information with a plurality of processing apparatuses that process objects, and a second communicating means for communicating conveyance control information, with a conveyance system comprising conveyance apparatuses for conveying the objects between the plurality of processing apparatuses. A means for predicting, on the basis of information communicated by the first communicating means, the conveying timing at which the processing apparatus needs to send out processed objects, and the conveying timing at which the processing apparatus needs to bring in unprocessed objects. A generating means generates the control information such that the conveyance apparatus will arrive at the processing apparatus that is the destination of the communication of information at the predicted timing predicted by the means for predicting.

Production efficiency improving apparatus, production efficiency improving method, and computer program

A carrying systemhas a carrying path which is laid out in such a manner as to pass through the lower sides of loading tableand the like provided at the front face side of treating devices, and covered by a cover. As the carrying path is positioned below the loading tables, the occupying areas of the loading tableand the like and portions of the region of the carrying path are shared so that space saving is achieved, and the accessibility to the treating deviceor the like from the front side thereof is improved, thereby realizing a layout which facilitates maintenance. A loading surfaceor the like of the loading tableis set to a height which allows a conventional overhead-type carrying systemand unmanned carrying vehicleof a floor-type carrying system to load an object on the loading surface, thereby ensuring the co-existence with the other carrying systems.

Carrying system, substrate treating device, and carrying method

The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches (150&#xb1;3 mm: SEAJ specification) or less for the semiconductor substrate. This manufacturing line comprises two sub-lines conforming to the same specifications, each of these sub-lines is composed of a series of processing units including a film forming unit, a pattern exposure unit, an etching unit, and a test unit. In at least one pattern exposure unit and one etching unit, fine processing of 0.3 &#x3bc;m or less can be performed.

Semiconductor device manufacturing method and manufacturing line thereof

There is provided a transfer apparatus capable of increasing the length of a transfer arm when it is extended, without increasing the size of the transfer arm when it is contracted. The transfer apparatuscomprising a transfer armwhich comprises: two rotating shaftsandarranged coaxially or in parallel; a pair of first armsand, one end portions of which are fixed to the rotating shaftsand, respectively; a pair of second armsand, one end portions of which are connected to the other end portions of the pair of first armsandby means of pins, respectively; and a holding portionfor holding an object w to be processed, the holding portionbeing connected to each of the other end portions of the pair of second armsandby means of pins, wherein the second armsandcross each other.

Transfer apparatus

Method of manufacturing semiconductor device and manufacturing line thereof

Two load lock chambers and are arranged between a first transfer chamber and a second transfer chamber . Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber is provided with a first transfer unit having two substrate holders each capable of holding a single object to be processed, in order to transport the wafer W among a load port site , the first load lock chamber , the second load lock chamber and a positioning unit . The second transfer chamber is provided with a second transfer unit having two substrate holders each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber , the second load lock chamber and respective vacuum processing chambers to . Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers. Additionally, it is possible to perform the delivery of the wafers promptly.

Processing apparatus

A drive mechanism provides a friction free movement of a movable member operated under a negative pressure environment. A gas bearing arrangement movably supports the movable element relative to a stationary element. The gas bearing arrangement is configured to be operated under the negative pressure environment inside the chamber. A drive arrangement drives the movable element from outside the chamber.

Drive mechanism having a gas bearing operable under a negative pressure environment

A wafer processing system comprises a container-housing chamber for housing the conveying container conveyed from the common area, a cleaning chamber disposed adjacent to the container-housing chamber, and a load-lock chamber disposed adjacent to the cleaning chamber. The cleaning chamber has an inlet line for introducing a clean gas into the cleaning chamber and a pressure control means for controlling the pressure in the cleaning chamber. The load-lock chamber has a conveying unit capable of extending to the container-housing chamber through the cleaning chamber, in order to take out the object from the conveying container housed in the container-housing chamber to the load-lock chamber through the cleaning chamber.

Controlling gas in a multichamber processing system

A transfer arm apparatus has first, second, and third arms. The second arm has a proximal link pivotally mounted on the distal end of the first arm, and first and second links connecting the proximal link and the third arm to constitute a link mechanism. The first and second links form a first pair of parallel links, and the proximal link and the third link form a second pair of parallel links connecting the first pair of parallel links. A transmission is contained in the first arm, and has an axial shaft and a hollow axial shaft coaxially arranged at the distal end of the first arm. The axial shaft transmits a rotational driving force to the first pair of parallel links, and the hollow axial shaft transmits a rotational driving force to the second pair of parallel links through the proximal link.

Transfer arm apparatus and semiconductor processing system using the same

A plurality of projections 21 is disposed on a inner surface of a lid 20 which is detachably attached to a carrier body 10. Each projection 21 has a tapered end part 22 with inclined surfaces 23, 24. The surfaces 23, 24 are in the form of semitransparent mirror. A Light emitting device 47 projects light beam which travels horizontally to the projection 21 from outside of the lid 20. When a wafer is not present in slots 15 of the carrier body, the light beam travels to upper and lower adjacent photoelectric devices 48, 48 via the upper and lower adjacent projections 21. The semitransparent mirror 23, 24 changes the light beam traveling direction. When the wafer is present in the slots 15, the light beam is intercepted by the wafer, and the photoelectric devices 48 does not receive the light beam. In aforementioned manner, whether a wafer is present or not in the slots 15 can be detected.

Wafer for carrying semiconductor wafers and method detecting wafers on

A relay apparatus according to the invention is provided for transferring to-be-treated objects between a transfer mechanism for carrying the objects into and out of a treatment chamber, and a cassette containing the objects. The relay apparatus comprises a transfer unit including holding portions for each holding a corresponding one of the objects from below, the transfer unit transferring the objects between the cassette and a transfer position at which the objects are transferred to the transfer mechanism, while holding the object with the holding portions, and a stopper located in the transfer position for adjusting positions of edge portions of all the objects held by the holding portions of the transfer means, thereby preventing the objects from moving horizontally relative to the holding portions.

Relay apparatus for relaying object to be treated

The cassette transfer mechanism of the present invention comprises a cassette chamber for housing a cassette storing a plurality of substrates, a liftable stand capable of moving up and down in the cassette chamber, a cassette holder having a bottom-surface supporting portion for supporting a bottom-surface of the cassette and a back-surface supporting portion for supporting a back-surface of the cassette, and a moving mechanism provided outside the cassette chamber and rotatably supporting the cassette holder, for moving the cassette holder between a waiting position outside the cassette chamber and the liftable stand inside the cassette chamber, wherein the moving mechanism has rotation mechanism for rotating the cassette holder around an axis crossed virtually in perpendicular to an axis extending along the moving direction of the liftable stand.

Cassette transfer mechanism

Vacuum process chambers are increased or decreased in number when the kind or order of processes is changed, and the shape and size of the transfer chamber are changed with the increase or decrease of the number of the vacuum process chambers, without entailing any change in a load-lock chamber and a transfer arm. The transfer arm has a minimum radius of rotation such that the arm can rotate in a transfer chamber of a minimum size corresponding to a minimum number of vacuum process chambers and a maximum arm reach such that the arm can deliver an object to-be-treated between each vacuum process chamber and a transfer chamber of a maximum size corresponding to a maximum number of vacuum process chambers. Thus, even though the number of the vacuum process chambers are increased or decreased with the change of the processes, it is necessary only that the shape and size of the transfer chamber be changed, and the other components, such as the load-lock chamber, transfer arm, etc., can be used in common, so that the manufacture and assembling of the system are very easy, ensuring a reduction in cost. Also, reduced-pressure treatment apparatus and a normal-pressure treatment apparatus are connected to each other by means of the load-lock chamber for replacement between the atmosphere and vacuum.

Growing community of inventors

Tokyo, Japan

Teruo Asakawa