Sharp Kabushiki Kaisha Corporation

Terumitsu Santo

Toshihiko Yoshida

Mamoru Okanishi

Hideki Ichikawa

Masao Yamazaki

There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor laser device. There are provided a stem provided with a plurality of lead pins through , a sub-mount that is die-bonded onto the stem and has its surface formed integrally with a monitoring PD and two semiconductor laser elements and that are die-bonded onto the sub-mount and have emission light monitored by the monitoring PD . A first bonding surface i.e. anode electrode of the monitoring PD and a second bonding surface i.e. end surface of a lead pin that is approximately perpendicular to the first bonding surface are wire-bonded to each other.

Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding

An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

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Gojo, Japan

Terumitsu Santo