Fujitsu Corporation

Terumi Kamifukumoto

Kenji Itasaka

Kazuto Tsuji

Yoshiyuki Yoneda

Hideharu Sakoda

Junichi Kasai

Toshimi Kawahara

Ryuji Nomoto

Toshiyuki Motooka

Masanori Onodera

Seiichi Orimo

Fumitoshi Fujisaki

Shinichiro Maki

Yuji Akasaki

Nobuo Ooyama

Masafumi Tetaka

Akihiro Shigeno

Ryoichi Yokoyama

Masao Fukunaga

Nobuo Ohyama

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.

Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame

A method of testing semiconductor devices includes an adhering step, a position correcting step, and an electrical test step. The adhering step includes adhering either a semiconductor device collective body or a plurality of individual semiconductor devices onto an adhesive tape provided on a tape-holding member, the semiconductor device collective body being constructed by a plurality of semiconductor devices integrated together. The position correcting step includes positioning the semiconductor devices by mounting the tape-holding member on a position correction unit and, using an image processing technique, implementing position recognition and position correction of the semiconductor devices adhered on the adhesive tape. The electrical test step includes implementing an electrical characteristic test on the semiconductor devices positioned in the position correction step by connected the semiconductor devices on a testing contactor.

Method and apparatus for testing semiconductor devices

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.

There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.

Method and apparatus for fabricating semiconductor device

Growing community of inventors

Kagoshima, Japan

Terumi Kamifukumoto