Sharp Kabushiki Kaisha Corporation

Terukazu Otsuki

Hiroshi Isoda

Masumi Nakamichi

Masakazu Ikeda

Jun Shintani

An enclosure is formed by folding an FPC board having, on the top face thereof, electronic components and, on the back face thereof, a ground conductor pattern in such a way that the electronic components mounted thereon are housed inside the enclosure. The electronic components housed inside the enclosure are covered with the ground conductor pattern. This means that the enclosure serves as a shield enclosure that electromagnetically shields at least part of the electronic components from the outside. In this way, the shield enclosure is formed by folding the FPC board. This makes it possible to realize an electromagnetic shield structure without using an extra shield case as used in the conventional modules.

Radio frequency module and manufacturing method thereof

An oscillator including a circuit board having a dielectric layer therein; an oscillator circuit comprising its components and an inductor element, the components being mounted on a front surface of the circuit board and at least a part of the inductor element being internally disposed in the dielectric layer; and a back conductor provided on a back surface of the circuit board; wherein the back conductor has two or more slits or pinholes through which a laser beam is passed for partially cutting the dielectric layer together with the internally disposed inductor element at plural sites for adjustment of an oscillation characteristic.

Oscillator and an oscillator characteristic adjustment method

A smaller oscillator module enables oscillation frequency to be adjusted from the back after assembly is finished. The oscillator has oscillator circuit components mounted on the front of a circuit board having an internal dielectric layer, a back conductor layer covering a major part of the back of the circuit board, and at least a part of an inductor element of the oscillator circuit disposed internally with a part of an intervening dielectric layer from the back conductor layer. A slit or pinhole is formed in the back conductor. The oscillation frequency can then be adjusted after assembly is completed by emitting a trimming laser through this slit or pinhole to change the inductance by partially removing the dielectric layer and inductor element.

Growing community of inventors

Nara, Japan

Terukazu Otsuki