Murata Manufacturing Co., Ltd.

Teruhisa Shibahara

Yuichi Takamine

Takahiro Oguchi

Norihiko Nakahashi

Yoshihiro Konaka

Kenji Tanaka

Hajime Kando

Akira Kumada

Keiichi Umeda

Masakazu Tani

Hiroki Watanabe

Hiroshi Yamada

Tetsuzo Hara

Yasuaki Shin

Seiichi Takahara

A calculation device for deriving solutions of a system of linear equations, which realizes a solution of the system of linear equations using an iterative method belonging to a Krylov subspace method, includes a plurality of arithmetic units. In the calculation device, a vector sequence x(k is a natural number containing 0) approximating to the solutions of the system of linear equations is formed by a plurality of components in accordance with an order of the vector sequence x, and when the vector sequence xis divided into a plurality of different regions corresponding to the plurality of components and the respective arithmetic units are caused to execute arithmetic processings corresponding to the plurality of different regions in parallel in iterative computation of causing the vector sequence xto approximate to the solutions, a preconditioned matrix that is used in the iterative computation is a diagonal matrix.

Calculation device and calculation method for deriving solutions of system of linear equations and program that is applied to the same

A variable capacitance device that operates properly at a point along a signal line through which a high-voltage RF signal passes while reducing a necessary DC voltage includes a substrate, a beam, and lower drive electrodes. The beam is connected to the substrate through a support portion. Lower drive electrodes and the beam generate a capacitance when a DC voltage is applied, and an electrostatic force due to this capacitance deforms the beam. The lower drive electrodes face the beam and are coupled to each other through the beam. An RF signal propagates between the lower drive electrodes.

Variable capacitance device

A variable capacitance device that achieves a desired capacitance even when factors causing varied capacitances are generated is configured such that a capacitance detection pulse signal is applied from a capacitance detection signal generation unit to a driving capacitor and a reference capacitor of a MEMS mechanical unit. The device voltage of the driving capacitor based on the capacitance detection signal and a driving voltage is applied to the inverting input terminal of a comparator. The device voltage of the reference capacitor based on the capacitance detection signal and the driving voltage is applied to the non-inverting input terminal of the comparator. The comparator generates a comparison output signal including 'Hi' and 'Low' values from the difference between these device voltages, and applies the output signal to a driving voltage generation unit. The driving voltage generation unit increases or decreases the driving voltage based on the comparison output signal.

A probe array base including probe-holding portions which are periodically arranged on a solid base member and which have grooves is prepared by anisotropically etching a single-crystalline silicon substrate. Probe solutions are supplied to the probe-holding portions by capillary action from a plurality of tank arrays having a certain cylinder period. This allows a probe array to be completed. The probe array is used as, for example, a DNA or antigen chip, has a high degree of integration, and is capable of holding a constant and sufficient number of probe molecules.

Probe array base, method for manufacturing probe array base, method for manufacturing probe array

A probe array substrate suitable for forming a probe array that has high packing density, that can hold sufficient amounts of probe molecules, and that has little variation in the amounts of probe molecules. A plurality of arrayed probe-holding portions are defined by recesses, and isolating grooves are formed between the adjacent probe-holding portions to prevent probe solutions introduced into the probe-holding portions from spreading to adjacent probe-holding portions. Inner surfaces of the probe-holding portions are made hydrophilic, whereas inner surfaces of the isolating grooves are made hydrophobic. Liquid-introducing protrusions are formed in the probe-holding portions.

Probe array substrate and method for producing the same, and probe array and method for producing the same

A probe array includes a probe-carrying substrate and a base member. The probe-carrying substrate has first and second principal surfaces extending parallel to each other, and a plurality of probe carriers carrying probe molecules. The base member has a reference surface extending parallel to a fluorescence-receiving surface, and a seating surface supporting the probe-carrying substrate and extending in a direction other than a direction parallel to the reference surface. The probe carriers each have a plurality of surfaces forming different angles with respect to the fluorescence-receiving surface, the plurality of surfaces including a bottom surface and uprising surfaces extending from the bottom surface. Accordingly, the plurality of surfaces have different sensitivities, realizing a wide dynamic range.

Probe array and method of manufacturing the same

An acoustic wave filter device having a balanced-to-unbalanced conversion function, in which the signal balance between a pair of balanced terminals is improved, has, on a piezoelectric substrate, one end of at least one longitudinally coupled resonator type acoustic wave filter and one end of at least one second longitudinally coupled resonator type acoustic wave filter among the rest of acoustic wave filters are commonly connected and connected to an unbalanced terminal, and the other ends of the longitudinally coupled resonator type acoustic wave filters are electrically connected to first and second balanced terminals, respectively, and in which a propagation direction of an acoustic wave in the longitudinally coupled resonator type acoustic wave filter and a propagation direction of an acoustic wave in the second longitudinally coupled resonator type acoustic filter are different from each other.

Acoustic wave filter device utilizing filters having different acoustic wave propagation directions

An elastic wave filter includes two longitudinally coupled resonator type elastic wave filter elements that are cascade connected with each other, each longitudinally coupled resonator type elastic wave filter element including three IDTs (interdigital transducers) arranged on a piezoelectric substrate in a transmitting direction of an elastic wave. In at least one of the longitudinally coupled resonator type elastic wave filter elements, electrode fingers of the IDTs that are cascade connected are arranged at a pitch that is smaller than a pitch of electrode fingers of the remaining IDT. The adverse effect of a parasitic capacitance in cascade connected wires disposed between the longitudinally coupled resonator type elastic wave filter elements is reduced so as to improve impedance matching of a cascade connected portion and to improve the VSWR characteristics of input-output terminals of the elastic wave filter.

Elastic wave filter and communication device equipped with the elastic wave filter

In an acoustic wave filter device, first and second surface acoustic wave filter sections implemented by longitudinally coupled resonators are arranged on a piezoelectric substrate. The first and second surface acoustic wave filter sections include first to third interdigital transducers and fourth to sixth interdigital transducers, respectively, arranged in a direction of propagation of surface waves. The first, third, fourth, and sixth interdigital transducers are connected to an unbalanced terminal. The second and fifth interdigital transducers are connected to first and second balanced terminals, respectively. Each of the second and fifth interdigital transducers has first and second interdigital transducer segments divided in the direction of propagation of acoustic waves. The first and second interdigital transducer segments are connected in series with each other.

Balanced acoustic wave filter

A boundary acoustic wave filter device capable of increasing an out-of-band attenuation includes a dielectric film formed on a piezoelectric substrate, at least one longitudinally coupled resonator boundary acoustic wave filter having a plurality of IDTs disposed along a boundary between the piezoelectric substrate and the dielectric film, and at least two one-terminal-pair boundary acoustic wave resonators. At least one boundary acoustic wave resonator is connected in series to the longitudinally coupled resonator boundary acoustic wave filter, and at least remaining one boundary acoustic wave resonator is connected in parallel to the longitudinally coupled resonator boundary acoustic wave filter. An anti-resonant frequency of the serially connected boundary acoustic wave resonator is located in a higher frequency range than a passband of the boundary acoustic wave filter device, and a resonant frequency of the parallel-connected boundary acoustic wave resonator is equal to or higher than the anti-resonant frequency of the serially connected boundary acoustic wave resonator.

Boundary acoustic wave filter device

A surface acoustic wave filter device includes an unbalanced terminal, first and second balanced terminals, and first, second and third IDTs. One end of the first IDT and one end of the third IDT are connected to the unbalanced terminal. The second IDT includes first and second divided IDT portions obtained by dividing the IDT in the surface wave propagating direction. The first and second divided IDT portions include sub-divided IDT portions and sub-divided IDT portions obtained by dividing the first and second divided IDT portions and in the crossing width direction. The first and second divided IDT portions are electrically connected in series. The first and second sub-divided IDT portions are electrically connected in series. The first and second sub-divided IDT portions are electrically connected in series. The second sub-divided IDT portion is connected to the first balanced terminal and the second sub-divided IDT portion is connected to the second balanced terminal.

Balanced acoustic wave filter device

An acoustic wave filter device includes a piezoelectric substrate and a longitudinally coupled resonator surface acoustic wave filter unit provided on the piezoelectric substrate. The surface acoustic wave filter unit includes first to fifth IDTs arranged in a surface wave propagation direction. The first, third, and fifth IDTs are connected to an unbalanced terminal, while the second and fourth IDTs are connected to first and second balanced terminals, respectively. The second IDT includes first and second sub-IDT portions obtained by dividing the second IDT and arranged in a crossing width direction, and the fourth IDT includes first and second sub-IDT portions obtained by dividing the fourth IDT and arranged in the crossing width direction. The first and second sub-IDT portions are connected in series. The first and second sub-IDT portions are also connected in series.

A surface acoustic wave (SAW) filter includes a piezoelectric substrate. A resin pattern having a permittivity less than that of the piezoelectric substrate and first and second conductor patterns are disposed on the piezoelectric substrate. The first conductor pattern defines two one-terminal-pair SAW resonators and two longitudinally coupled resonator SAW filters. A portion of the second conductor pattern defines wiring traces having different potentials. Portions of the wiring traces facing each other in a plan view are disposed on the resin pattern.

Surface acoustic wave filter and communication apparatus

A longitudinally-coupled-resonator-type surface acoustic wave filter includes three interdigital transducers provided on a piezoelectric substrate in the direction in which surface acoustic waves propagate. An interdigital transducer disposed at the approximate center among the three interdigital transducers of the longitudinally-coupled-resonator-type surface acoustic wave filter is divided into two parts substantially symmetrically in the propagation direction of the surface acoustic waves and the two parts are connected to balanced signal terminals, respectively. Left and right interdigital transducers of which the polarities are inverted relative to each other are connected to an unbalanced signal terminal to provide a balanced-to-unbalanced conversion function. A reactance component provided on the piezoelectric substrate, inside a package, or outside the package is connected to either of the balanced signal terminals.

Surface acoustic wave apparatus and communication apparatus

In a surface acoustic wave device in which balanced terminals extend from series IDTs, noise coming from an electrical-potential signal at the series connection point of the series IDTs is removed to improve the degree of balance. A surface acoustic wave filter includes a pair of surface acoustic wave reflectors disposed on a piezoelectric substrate along the propagation direction of surface acoustic waves, and a plurality of IDTs disposed between the two surface acoustic wave reflectors. Two opposing electrode fingers of the IDTs, which are series IDTs, are connected to corresponding balanced terminals, and the series connection point thereof is grounded. As a result, noise coming from an abnormal electrical-potential signal generated at the series connection point is removed to improve the degree of balance between the balanced terminals.

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Kanazawa, Japan

Teruhisa Shibahara