Mitsubishi Denki Kabushiki Kaisha

Teruhisa Ohkawa

Tetsuo Kobayashi

Kazuhide Deguchi

A semiconductor device includes a semiconductor chip on which a semiconductor element is disposed, the material of the surface emitting a quantity of radiation at a first predetermined temperature, and markers which identify a plurality of points on the surface region, disposed on the surface and formed of a second material which emits a second quantity of radiation, different from the first quantity at the predetermined temperature.

Semiconductor device with infrared mapping markers

A hybrid integrated circuit module asssembly includes a conductive casing having at least a pair of inner surfaces facing each other, first and second insulating substrates mounted on the inner surfaces and facing each other, and first and second circuits which may be a power amplifier circuit and a driving circuit for driving the power amplifier circuit, the first and the second circuits being formed on the facing surfaces of the first and second insulating substrates, respectively.

Growing community of inventors

Itami, Japan

Teruhisa Ohkawa