Mitsubishi Denki Kabushiki Kaisha

Teruhisa Fujihara

Kenji Ohgiyama

Tamotsu Ueda

Minoru Oohira

Atsushi Yamasaki

Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.

Semiconductor device having pads for connecting a semiconducting element to a mother board

A semiconductor device including at least one die bond pad; at least one semiconductor element mounted on the at least one die bond pad; a plurality of substantially parallel wire bond pads connected to electrodes of the at least one semiconductor element, and disposed substantially in parallel to the at least one die bond pad in a longitudinal direction; and a sealing resin configured to mold the at least one semiconductor element, wherein back surfaces of the at least one die bond pad and the plurality of parallel wire bond pads are free from the sealing resin.

Semiconductor device and lead frame

Method of producing semiconductor device and configuration thereof, and lead frame used in said method

Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.

Growing community of inventors

Isahaya, Japan

Teruhisa Fujihara