Kabushiki Kaisha Toyota Chuo Kenkyusho

Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Mirise Technologies Corporation

Tohoku University

Teruhisa Akashi

Hirofumi Funabashi

Yutaka Nonomura

Motohiro Fujiyoshi

Shota Harada

Keitaro Ito

Yoshiteru Omura

Yuuki Inagaki

Yoshiyuki Hata

Katsuaki Goto

Hidehito Matsuo

Takahiko Yoshida

Norio Fujitsuka

Isao Aoyagi

Kanae Murata

Hiroko Iguchi

Shigeo Hori

Keiichi Shimaoka

Takashi Ozaki

Megumi Suzuki

Yusuke Kawai

Naoki Yoshida

Masayoshi Esashi

Shuji Tanaka

Takahiro Nakayama

Takashi Katsumata

Hitoshi Yamada

Kazuyoshi Tomita

Ui Yamaguchi

Toshihiko Tani

Tomoya Jomori

Tetsuo Narita

Kenji Nakashima

Mitsutoshi Makihata

Masanori Muroyama

Hideo Yamada

Hideki Terasawa

Yasuo Yamamoto

Eiko Ishii

Yumi Saito

Suguru Houchi

A multi-axis inertial force sensor includes a mounting material, blocks, and sensors. Each block has a positioning portion that determines its position relative to a contact partner. A pedestal is formed by an assembly of the blocks where the positions are determined relative to each other based on the positioning portion and where inclined surfaces are oriented in different directions. The sensors are respectively arranged on the inclined surfaces of the pedestal so that the main axes are oriented in different directions to detect vector components of inertial force corresponding to the main axes.

Multi-axis inertial force sensor

An electronic device includes a mounting member having a surface, an electronic component, a solder and a sidefill. The electronic component has a plurality of electrodes on a surface and is mounted on the surface of the mounting member so that the surface of the electronic component having the electrodes faces the surface of the mounting member. The solder is disposed between the mounting member and at least one of the electrodes of the electronic component to electrically and mechanically connect between the at least one of the electrodes and the mounting member. The sidefill is disposed on a periphery of the solder and mechanically connects between the electronic component and the mounting member.

Electronic device

A micro vibration body includes a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion. A mounting substrate includes an inner frame portion and electrode portions, which surround an inner frame portion. A joining member is provided in an inner region of the mounting substrate surrounded by the inner frame portion. The recessed portion of the micro vibration body has a bottom surface defining a mounted surface located in the inner region and joined to the mounting substrate via the joining member. The curved surface portion has a rim that includes an end portion of the curved surface portion on an opposite side to the recessed portion. The rim has a rim lower surface located on a same plane as the mounted surface or a tip end portion of the mounted surface.

Inertial sensor and method for manufacturing the same

An electronic device includes a component mounting portion, an electronic component disposed on the component mounting portion, a solder between the component mounting portion and the electronic component, a mounting base member, and a supporting beam connecting the component mounting portion and the mounting base member. The supporting beam has a plurality of bent portions. The supporting beam includes a frame, an outer supporting portion connecting the frame and the mounting base member, and an inner supporting portion connecting the frame and the component mounting portion. The inner supporting portion is shifted from the outer supporting portion along the frame. One of the plurality of bent portions is a connecting portion between the frame and the outer supporting portion. Another of the plurality of bent portions is a connecting portion between the frame and the inner supporting portion.

A support structure for a micro-vibrator includes: a micro-vibrating body having a curved surface portion and a recess recessed from the curved surface portion; and a support member having a rod and an adhesive member arranged at a tip end of the rod. The support member is adhered on a connecting surface of the recess through the adhesive member. The connecting surface of the recess is an internal bottom surface of the recess.

Support structure for micro-vibrator and method of manufacturing inertial sensor

Before a pedestal is assembled, a sensitivity is inspected for each of sensors disposed in blocks respectively. In an inspection step, the blocks in which the sensors are disposed respectively are prepared. The blocks are fitted into main-axis groove portions of a main-axis tray, and the blocks are brought in contact with main-axis positioning surfaces of the main-axis groove portions to dispose the thickness direction of the main-axis tray and the main-axes of the sensors in parallel. The main-axis tray is arranged on a turntable such that a central axis of rotation of the turntable and the thickness direction of the main-axis tray are in parallel and that the central axis of rotation of the turntable and the main-axes of the sensors are in parallel. The turntable is made pivoting or swinging to inspect the sensitivities, in the main-axes, of the of sensors.

Method for manufacturing multi-axial inertial force sensor

A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.

Molding device

A recess is formed in one silicon substrate. A silicon oxide film is formed in another one silicon substrate at a portion space apart from a space-to-be-formed region. The silicon oxide film has a groove surrounding the space-to-be-formed region and extending to an outer periphery of the other one silicon substrate. Further, the other one silicon substrate and the one silicon substrate are directly bonded to each other via the silicon oxide film so as to cover the groove. A gas discharge passage, a stacking structure of the silicon substrates and the silicon oxide film are formed, and the space is formed inside the stacking structure by the recess. Then, by the heat treatment, the gas inside the space is discharged to the outside of the stacking structure through the gas discharge passage.

Semiconductor device and method for manufacturing the same

A controller applies a predetermined voltage to a fixed part detection excitation electrode to vibrate a movable part in a second direction and simultaneously applies a predetermined voltage to a fixed part drive electrode to vibrate the movable part in a first direction. The controller acquires, of the movable part, a first resonance frequency along the first direction and a second resonance frequency along the second direction. The controller controls a drive spring adjustment part to adjust a spring constant of the drive spring, such that the first resonance frequency is maintained constant, and controls a detection spring adjustment part to adjust a spring constant of the detection spring such that the second resonance frequency is maintained constant. The controller detects the angular velocity based on a result of synchronously detecting signal from the fixed part detection electrode with the first resonance frequency.

Angular velocity sensor and angular velocity sensor system

An electrostatic actuator includes a fixed electrode and a movable electrode arranged to face the fixed electrode. The movable electrode is configured to be displaceable with respect to the fixed electrode and a fixed portion. An attractive force acts between the movable electrode and the fixed portion. In the electrostatic actuator, a non-linear vibration of the movable electrode when a voltage is applied to the fixed electrode and the movable electrode is reduced by the attractive force acting between the movable electrode and the fixed portion.

Electrostatic actuator and physical quantity sensor

A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

Inertial sensor

In a semiconductor device, a first substrate and a second substrate are bonded to each other through an insulating film. A hermetically sealed chamber is provided between the first substrate and the second substrate, and a sensing part is enclosed in the hermetically sealed chamber. The second substrate has a through hole penetrating in a stacking direction of the first substrate and the second substrate and exposing the first surface of the first substrate. A penetrating electrode is disposed on a wall surface of the through hole of the second substrate, and is electrically connected to the sensing part. A discharge path is provided, at a position located between the hermetically sealed chamber and the through hole for releasing outgas generated during bonding from the hermetically sealed chamber to the through hole.

Semiconductor device with discharge path, and method for producing the same

A fuel cell system may include a first fuel cell provided on a first substrate; a second fuel cell provided on a second substrate, and having a power generation capacity higher than a power generation capacity of the first fuel cell; a first heater provided at the first fuel cell; a second heater provided at the second fuel cell; and a battery, wherein the first heater heats the first fuel cell by using power supplied from the battery, and wherein the second heater heats the second fuel cell by using power supplied from the first fuel cell.

Fuel cell system

A solid oxide fuel cell is disclosed herein. The fuel cell includes a silicon substrate, an electrolyte film laminated on the silicon substrate, and a gas flow path formed inside the silicon substrate. The electrolyte film is opposed to the gas flow path via an electrode film. A portion of a side wall of the gas flow path has a fillet shape, and the portion is close to the electrolyte film.

Fuel cell

A solid oxide fuel cell includes an Si support substrate having a through hole, an electrolyte film formed on the surface of an Si support substrate and containing a solid oxide having oxygen ion conductivity, a first electrode formed on a surface of the electrolyte film (surface on the side opposite to the Si support substrate), and a second electrode formed at least on a surface exposed from the through hole in a rear face of the electrolyte film. The electrolyte film includes a porous layer including the solid oxide and containing pores inside, a first dense layer formed on a surface of the porous layer (surface on the side opposite to the Si support substrate), and a second dense layer formed at the interface between a rear face of the porous layer and the Si support substrate.

Solid oxide fuel cell

Growing community of inventors

Nagoya, Japan

Teruhisa Akashi