Tokyo Ohka Kogyo Co., Ltd.

Central Japan Railway Company

Teruhiro Uematsu

Kunihiro Noda

Toshiyuki Ogata

Tetsuya Shichi

Kiminori Oshio

Akimasa Nakamura

Masaru Shida

Motoki Takahashi

Christopher Cordonier

Naoya Katsumata

Tetsuro Kinoshita

Takeshi Hikima

A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

Protective film forming agent for plasma dicing and method for manufacturing semiconductor chip

A dispersion liquid including a fiber material which is capable of forming a porous film having high porosity; a porous film formed using the dispersion liquid; a power storage element including the porous film; and a method for producing a porous film using the dispersion liquid. In the dispersion liquid including the fiber material and an organic solvent, which is used for forming a porous film by applying and drying, the fiber material contains a predetermined amount of a modified cellulose fiber including a carboxy group or a metal salt thereof, and the amount of water in the dispersion liquid is 5% by mass or less.

Dispersion liquid used for forming porous film, porous film, power storage element, and method for producing porous film

A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120&#xb0; C. to 350&#xb0; C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent including at least a compound represented by the general formula (1), in which Rrepresents a hydrogen atom or a hydroxyl group, Rand Rindependently represent a hydrogen atom or a Cto Calkyl group, and Rand Rindependently represent a Cto Calkyl group. 

Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution

A photosensitive resin composition for dry etching including a water-soluble resin, a photopolymerizable monomer, and a photopolymerization initiator, and a method for producing a resist pattern for dry etching. The method includes forming a resin layer with the photosensitive resin composition on a substrate; exposing the resin layer with positional selectivity; and developing the exposed resin layer with water at a temperature less than 50&#xb0; C., so as to form a resist pattern.

Photosensitive resin composition for dry etching, and method for producing resist pattern for dry etching

Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.

Positive-type photosensitive composition

A photosensitive resin composition and a photosensitive dry film which are excellent in both sensitivity and stability and are well-balanced in tent strength, resolution and plating non-staining are provided. The photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and the polymerization initiator (C) comprises a hexaarylbisimidazole based compound (C1) and a multifunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed from the photosensitive resin composition on a support film.

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Kawasaki, Japan

Teruhiro Uematsu